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"Broadbent, Eliot K"
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Search Results - "Broadbent, Eliot K"
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"Broadbent, Eliot K"
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APPARATUS AND METHOD FOR BACKSIDE PROTECTION DURING SUBSTRATE PROCESSING
by
THOMAS, MICHAEL E
,
BROADBENT
,
ELIOT K
,
VANDE VEN, EVERHARDUS P
Year of Publication
23.05.1997
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INDUCTION PLASMA SOURCE
by
BENZING, JEFFREY C
,
ROUGH J. KIRKWOOD H
,
BROADBENT
,
ELIOT K
Year of Publication
24.04.1997
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Electroplating system with shields for varying thickness profile of deposited layer
by
BROADBENT
;
ELIOT K
Year of Publication
22.02.2000
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ELECTROPLATING SYSTEM WITH SHIELDS FOR VARYING THICKNESS PROFILE OF DEPOSITED LAYER
by
BROADBENT
,
ELIOT
,
K
Year of Publication
02.09.1999
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ELECTROPLATING SYSTEM WITH SHIELDS FOR VARYING THICKNESS PROFILE OF DEPOSITED LAYER
by
BROADBENT
,
ELIOT
,
K
Year of Publication
29.07.1999
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ELECTROPLATING SYSTEM WITH SHIELDS FOR VARYING THICKNESS PROFILE OF DEPOSITED LAYER
by
BROADBENT
,
ELIOT
,
K
Year of Publication
27.05.1999
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Variable rate semiconductor deposition process
by
BROADBENT
;
ELIOT K
Year of Publication
22.01.1985
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Magnetron sputtering equipment
by
MILLER, KENNETH C
,
BROADBENT
,
ELIOT K
Year of Publication
28.02.1996
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Magnetron sputtering apparatus and method
by
ELIOT K BROADBENT
,
KENNETH C MILLER
Year of Publication
23.11.1994
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MAGNETRON SPUTTERING INVOLVING USE OF A MAGNET TRACK WITH A COMPLEX CLOSED CURVE
by
ELIOT K BROADBENT
,
KENNETH C MILLER
Year of Publication
28.04.1993
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Sweeping method and magnet track apparatus for magnetron sputtering
by
BROADBENT
;
ELIOT K
,
MILLER; KENNETH C
Year of Publication
23.02.1993
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COOLING METHOD AND APPARATUS FOR MAGNETRON SPUTTERING
by
BROADBENT
;
ELIOT K
,
MILLER; KENNETH C
Year of Publication
15.12.1992
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MAGNETRON SPUTTERING EQUIPMENT
by
MILLER, KENNETH C
,
BROADBENT
,
ELIOT K
Year of Publication
05.08.1992
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Magnetron sputtering equipment
by
MILLER, KENNETH C
,
BROADBENT
,
ELIOT K
Year of Publication
01.07.1992
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Method of generating plasma having high ion density for substrate processing operation
by
BENZING; JEFFREY C
,
BROADBENT
;
ELIOT K
,
ROUGH; J. KIRKWOOD H
Year of Publication
25.02.1997
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Induction plasma source
by
BENZING; JEFFREY C
,
BROADBENT
;
ELIOT K
,
ROUGH; J. KIRKWOOD H
Year of Publication
11.04.1995
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Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
by
BROADBENT
;
ELIOT K
,
PATTON; EVAN E
,
REID; JONATHAN D
,
CONTOLINI; ROBERT J
,
OPOCENSKY; EDWARD C
Year of Publication
19.12.2000
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Induction plasma source
by
BENZING; JEFFREY C
,
BROADBENT
;
ELIOT K
,
ROUGH; KIRKWOOD H
Year of Publication
13.09.1994
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Induction plasma source
by
BENZING, JEFFREY C
,
ROUGH, J. KIRKWOOD H
,
BROADBENT
,
ELIOT K
Year of Publication
11.05.1994
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Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer
by
BROADBENT
;
ELIOT K
,
PATTON; EVAN E
,
REID; JONATHAN D
,
CONTOLINI; ROBERT J
,
OPOCENSKY; EDWARD C
Year of Publication
29.08.2000
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