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Year of Publication 14.08.2008
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ELECTROLESS NIWP ADHESION AND CAPPING LAYERS FOR TFT COPPER GATE PROCESS
HSIUNG, CHIUNG, SHENG, CHEN, SHYUAN-FANG, CHEN, IUNG, NASU, AKINOBU, LIN, TSU-AN
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Year of Publication 09.04.2008
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ELECTROLESS NIP ADHESION AND/OR CAPPING LAYER FOR COPPER INTERCONNECTION LAYER
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Year of Publication 09.06.2009
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ELECTROLESS NIWP ADHESION AND CAPPING LAYERS FOR TFT COPPER GATE PROCESS
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Year of Publication 18.01.2007
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Electroless nip adhesion and/or capping layer for copper interconnection layer
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Year of Publication 01.12.2013
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Electroless NiP adhesion and/or capping layer for copper interconnection layer
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Year of Publication 01.04.2008
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