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Search Results - "PIERSON; MARK V"
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"PIERSON; MARK V"
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Z interconnect structure and method
by
PIERSON MARK V
,
JIMAREZ LISA J
Year of Publication
18.05.2010
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Z interconnect structure and method
by
PIERSON MARK V
,
JIMAREZ LISA J
Year of Publication
10.03.2005
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Z interconnect structure and method
by
PIERSON MARK V
,
JIMAREZ LISA J
Year of Publication
19.10.2004
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Low or no-force bump flattening structure and method
by
PIERSON MARK V
,
TRIVEDI AJIT K
Year of Publication
06.01.2004
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Low or no-force bump flattening structure and method
by
PIERSON MARK V
,
TRIVEDI AJIT K
Year of Publication
10.07.2003
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Z interconnect structure and method
by
PIERSON MARK V
,
JIMAREZ LISA J
Year of Publication
10.07.2003
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PIN RETENTION METHOD AND APPARATUS
by
PIERSON
,
MARK V
Year of Publication
05.06.1991
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Method of making electrically conductive contacts on substrates
by
PIERSON MARK V
,
MEAD DONALD I
Year of Publication
04.02.2003
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Method of making electrically conductive contacts on substrates
by
PIERSON MARK V
,
MEAD DONALD I
Year of Publication
03.01.2002
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Pin retention method and apparatus
by
PIERSON
;
MARK V
Year of Publication
03.05.1988
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Pin retention method and apparatus
by
PIERSON
,
MARK V
Year of Publication
30.03.1988
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Flip chip C4 extension structure and process
by
JIMAREZ MIGUEL A
,
PIERSON MARK V
,
MILKOVICH CYNTHIA S
Year of Publication
18.10.2005
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Method of making electrically conductive contacts on substrates
by
PIERSON MARK V
,
MEAD DONALD I
Year of Publication
16.01.2001
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Flip chip C4 extension structure and process
by
JIMAREZ MIGUEL A
,
PIERSON MARK V
,
MILKOVICH CYNTHIA S
Year of Publication
29.06.2004
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Flip chip C4 extension structure and process
by
JIMAREZ MIGUEL A
,
PIERSON MARK V
,
MILKOVICH CYNTHIA S
Year of Publication
20.05.2004
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LONGITUDINALLY FED COMPONENT INSERTION APPARATUS
by
PIERSON
,
MARK V
Year of Publication
10.04.1979
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VORRICHTUNG ZUM EINSETZEN ELEKTRONISCHER BAUELEMENTE IN EINE LEITERPLATTE
by
V
.
PIERSON
,
MARK
Year of Publication
08.12.1977
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Longitudinally fed component insertion apparatus
by
PIERSON
;
MARK V
Year of Publication
21.06.1977
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Surface metal balancing to reduce chip carrier flexing
by
JIMAREZ MIGUEL A
,
PIERSON MARK V
,
JIMAREZ LISA J
Year of Publication
24.12.2002
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Wafer scale encapsulation for integrated flip chip and surface mount technology assembly
by
PIERSON MARK V
,
TRIVEDI AJIT K
,
BERNIER WILLIAM E
Year of Publication
10.12.2002
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casings or constructional details of electric apparatus
electric techniques not otherwise provided for
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manufacture of assemblages of electrical components
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