CHROMIUM ADHESION LAYER FOR COPPER VIAS IN LOW-K TECHNOLOGY
ENGEL, BRETT, H, SEO, SOONON, WANG, YUN-YU, WONG, HON WONG, MILLER, JOHN, A, HOINKIS, MARK
Year of Publication 13.05.2009
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Year of Publication 13.05.2009
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Chromium adhesion layer for copper vias in low-k technology
SEO, SOONON, WANG, YUN-YU, MILLER, JOHN A, ENGEL, BRETT H, HOINKIS, MARK
Year of Publication 01.01.2003
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Year of Publication 01.01.2003
Patent
CHROMIUM ADHESION LAYER FOR COPPER VIAS IN LOW-K TECHNOLOGY
ENGEL, BRETT, H, SEO, SOONON, WANG, YUN-YU, WONG, HON WONG, MILLER, JOHN, A, HOINKIS, MARK
Year of Publication 29.10.2003
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Year of Publication 29.10.2003
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Chromium adhesion layer for copper vias in low-k technology
SEO SOONON, ENGEL BRETT H, HOINKIS MARK, MILLER JOHN A, WANG YUN-YU, WONG KWONG HON
Year of Publication 01.04.2003
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Year of Publication 01.04.2003
Patent
CHROMIUM ADHESION LAYER FOR COPPER VIAS IN LOW-K TECHNOLOGY
ENGEL, BRETT, H, SEO, SOONON, WANG, YUN-YU, WONG, HON WONG, MILLER, JOHN, A, HOINKIS, MARK
Year of Publication 18.07.2002
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Year of Publication 18.07.2002
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Chromium adhesion layer for copper vias in low-k technology
SEO SOONON, ENGEL BRETT H, HOINKIS MARK, MILLER JOHN A, WANG YUN-YU, WONG KWONG HON
Year of Publication 11.07.2002
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Year of Publication 11.07.2002
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