Recent advances in drop-impact reliability
Wong, E.H., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Owens, N., Lai, Y.-S.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
Structure property correlation of epoxy resins under the influence of moisture; and comparison of diffusion coefficient with MD-simulations
Dermitzaki, E., Wunderle, B., Bauer, J., Walter, H., Michel, B.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
A derivatives-based method for parameterization of MEMS Reduced Order Models
Kolchuzhin, V., Doetzel, W., Mehner, I.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
Effect of thermomechanical stress on resonant frequency shift of a silicon MEMS resonator
Gonzalez, M., Jourdain, A., Vandevelde, B., Tilmans, H.A.C.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
Modeling of smart compliant electro-active polymer actuator
Soulimane, S., Al Ahmad, M., Matmat, M., Camon, H.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
Lead-free solder material characterization for thermo-mechanical modeling
Poh, E.S.W., Zhu, W.H., Zhang, X.R., Wang, C.K., Sun, A.Y.S., Tan, H.B.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
Characterization of dynamic behavior of Pb-free material 95.7Sn3.8Ag0.5Cu and its determination of dynamic constitutive model parameters
Liang Lihua, Chen Xuefan, Wang Qiang, Liu Fei, Yong Liu, Irving, S., Timwah Luk
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
Investigation of the stress-strain curves of lead-free solder alloy
Niu Xiaoyan, Ma Yong, Li Zhigang, Shu Xuefeng, Yang Guitong
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
Cavitation instability in the plastic IC packaging material due to moisture-induced vapor pressure and thermal stress
Li Zhigang, Niu Xiaoyan, Ma Yong, Shu Xuefeng, Yang Guitong
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
Simulation based analysis of secondary effects on solder fatigue
Dudek, R., Doering, R., Bombach, C., Michel, B.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
A characterization method for viscoelastic bulk modulus of molding compounds
Saraswat, M.K., Jansen, K.M.B., Patel, M.D., Ernst, L.J., Bohm, C., Kessler, A., Preu, H., Stecher, M.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
Effects of detailed substrate modeling and solder layout design on the 1st and 2nd level solder joint reliability for the large die FCBGA
Biswas, K., Shiguo Liu, Xiaowu Zhang, Chai, T.C.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
Lifetime prediction of BGA assembles with experimental torsion test and finite element analysis
Maia Filho, W.C., Brizoux, M., Fremont, H., Danto, Y.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
FEM simulation study on the free drop of electronic modules based on calibrated and validated models
Gromala, P., Muller, A., Rzepka, S.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding