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A Wafer-Level Sn-Rich Au-Sn Bonding Technique and Its Application in Surface Plasmon Resonance Sensors
by
毛旭 吕兴东 魏伟伟 张喆
杨
晋玲 祁
志美 杨
富华
Published in
Chinese physics letters
(01.05.2014)
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bonding
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bonding strength
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Institute of Physics (IOP) Publishing Journals
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