Search Results - "Peng, Jung-Huei" :: K.UTB vyhledávací portál

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CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME

by PENG JUNG HUEI, CHU CHIA HUA, LAI FEI LUNG, LIN SHIANG CHI
Year of Publication 25.04.2017

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Methods Of Forming Optical Modules

by Peng, Jung-Huei, Cheng, Chun-Wen, Wu, Yi-Chien
Year of Publication 05.10.2023

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MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portion

by Lin, Hung-Hua, Peng, Jung-Huei, Liu, Ping-Yin, Wu, Chang-Ming, Yu, Chung-Yi
Year of Publication 19.03.2024

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Semiconductor MEMS structure

by Peng, Jung-Huei, Lin, Hsing-Lien, Hsieh, Yuan-Chih, Wu, Yi-Chien
Year of Publication 26.09.2023

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METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CMOS WAFER TO A MEMS WAFER

by Lin, Hung-Hua, Peng, Jung-Huei, Liu, Ping-Yin, Wu, Chang-Ming, Yu, Chung-Yi
Year of Publication 30.06.2022

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Semiconductor structure for MEMS device

by Peng, Jung-Huei, Liu, Yu-Chia, Cheng, Chun-Wen, Chu, Chia-Hua
Year of Publication 26.04.2022

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Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer

by Lin, Hung-Hua, Peng, Jung-Huei, Liu, Ping-Yin, Wu, Chang-Ming, Yu, Chung-Yi
Year of Publication 22.03.2022

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MEMS devices including MEMS dies and connectors thereto

by Peng, Jung-Huei, Tsai, Hung-Chia, Teng, Yi-Chuan, Cheng, Chun-Wen, Tsai, Shang-Ying
Year of Publication 14.09.2021

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Fluid deposition apparatus and method

by Peng, Jung-Huei, Liu, Yi-Shao, Lai, Fei-Lung, Cheng, Chun-Wen, Tsai, Shang-Ying
Year of Publication 08.06.2021

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Cap and substrate electrical connection at wafer level

by PENG JUNG-HUEI
Year of Publication 17.12.2013

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Optical modules and method of forming the same

by CHENG, CHUN-WEN, WU, YIIEN, PENG, JUNG-HUEI
Year of Publication 16.12.2023

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MEMS devices with an element having varying widths

by Lin, Hung-Hua, Peng, Jung-Huei, Huang, Yao-Te, Pan, Lung Yuan, Tsai, Shang-Ying, Huang, Hsin-Ting
Year of Publication 28.09.2021

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Semiconductor MEMS structure

by Peng, Jung-Huei, Lin, Hsing-Lien, Hsieh, Yuan-Chih, Wu, Yi-Chien
Year of Publication 29.09.2020

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Semiconductor structure for MEMS device

by Peng, Jung-Huei, Liu, Yu-Chia, Cheng, Chun-Wen, Chu, Chia-Hua
Year of Publication 25.08.2020

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MEMS devices including MEMS dies and connectors thereto

by Peng, Jung-Huei, Tsai, Hung-Chia, Teng, Yi-Chuan, Cheng, Chun-Wen, Tsai, Shang-Ying
Year of Publication 14.07.2020

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MEMS devices including MEMS dies and connectors thereto

by Peng, Jung-Huei, Tsai, Hung-Chia, Teng, Yi-Chuan, Cheng, Chun-Wen, Tsai, Shang-Ying
Year of Publication 17.12.2019

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MEMS and CMOS integration with low-temperature bonding

by Chu Chia-Hua, Cheng Chun-Wen, Peng Jung-Huei
Year of Publication 21.11.2017

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METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CMOS WAFER TO A MEMS WAFER

by Lin, Hung-Hua, Peng, Jung-Huei, Liu, Ping-Yin, Wu, Chang-Ming, Yu, Chung-Yi
Year of Publication 08.08.2019

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Camera module and forming method thereof

by CHENG, CHUN-WEN, CHEN, TSUN-HSU, WU, YIIEN, PENG, JUNG-HUEI
Year of Publication 16.03.2024

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Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer

by Lin, Hung-Hua, Peng, Jung-Huei, Liu, Ping-Yin, Wu, Chang-Ming, Yu, Chung-Yi
Year of Publication 21.05.2019

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