VERFAHREN ZUR HERSTELLUNG VON DIELEKTRISCHEN ZWISCHENSCHICHTEN MIT NIEDRIGER DIELEKTRIZITÄTSKONSTANTE FÜR BEOL- VERBINDUNGSLEITUNGEN MIT VERBESSERTER HAFTUNG UND NIEDRIGER FEHLERDICHTE
HEDRICK, JEFFREY, CURTIS, ECKERT, ANDREW, ROBERT, HAY, JOHN, C, LEE, KANG-WOOK, SIMONYI, EVA, ERIKA, LINIGER, ERIC, GERHARD
Year of Publication 15.08.2006
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Year of Publication 15.08.2006
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Ultralow dielectric constant layer with controlled biaxial stress
SHAW THOMAS MCCARROLL, NEUMAYER DEBORAH ANN, LINIGER ERIC GERHARD, LANE MICHAEL WAYNE, GRILL ALFRED, NGUYEN SON VAN, LIU XIAO HU, DIMITRAKOPOULOS CHRISTOS DIMITRIOS, GATES STEPHEN MCCONNELL
Year of Publication 15.04.2008
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Year of Publication 15.04.2008
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METHOD OF FABICATING LOW-DIELECTRIC CONSTANT INTERLEVEL DIELECTRIC FILMS FOR BEOL INTERCONNECTS WITH ENHANCED ADHESION AND LOW-DEFECT DENSITY
HEDRICK, JEFFREY, CURTIS, ECKERT, ANDREW, ROBERT, HAY, JOHN, C, LEE, KANG-WOOK, SIMONYI, EVA, ERIKA, LINIGER, ERIC, GERHARD
Year of Publication 12.07.2006
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Year of Publication 12.07.2006
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Method of fabricating low-dielectric constant interlevel dielectric films for back base line interconnects with enhanced adhesion and low-defect density
SIMONYI EVA ERIKA,LEE KANG-WOOK,HAY JOHN C.,ECKERT ANDREW ROBERT,HEDRICK JEFFREY CURTIS,LINIGER ERIC GERHARD
Year of Publication 12.04.2006
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Year of Publication 12.04.2006
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On-chip Cu interconnection using 1 to 5 nm thick metal cap
GIGNAC LYNNE MARIE, BRULEY JOHN, HU CHAO-KUN, LINIGER ERIC GERHARD, ROSSNAGEL STEPHEN M, CARRUTHERS ROY A, MALHOTRA SANDRA GUY
Year of Publication 24.07.2007
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Year of Publication 24.07.2007
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Method of fabricating low-dielectric constant interlevel dielectric films for beol interconnects with enhanced adhesion and low-defect density
SIMONYI EVA ERIKA, HEDRICK JEFFREY CURTIS, LEE KANG-WOOK, LINIGER ERIC GERHARD, ECKERT ANDREW ROBERT, HAY JOHN C
Year of Publication 24.11.2004
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Year of Publication 24.11.2004
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METHOD OF FABICATING LOW-DIELECTRIC CONSTANT INTERLEVEL DIELECTRIC FILMS FOR BEOL INTERCONNECTS WITH ENHANCED ADHESION AND LOW-DEFECT DENSITY
HEDRICK, JEFFREY, CURTIS, ECKERT, ANDREW, ROBERT, HAY, JOHN, C, LEE, KANG-WOOK, SIMONYI, EVA, ERIKA, LINIGER, ERIC, GERHARD
Year of Publication 25.02.2004
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Year of Publication 25.02.2004
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METHOD OF FABRICATING LOW-DIELECTRIC CONSTANT INTERLEVEL DIELECTRIC FILMS FOR BEOL INTERCONNECTS WITH ENHANCED ADHESION AND LOW-DEFECT DENSITY
HEDRICK, JEFFREY, CURTIS, ECKERT, ANDREW, ROBERT, HAY, JOHN, C, LEE, KANG-WOOK, SIMONYI, EVA, ERIKA, LINIGER, ERIC, GERHARD
Year of Publication 18.12.2003
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Year of Publication 18.12.2003
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Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density
SIMONYI EVA ERIKA, HEDRICK JEFFREY CURTIS, LEE KANG-WOOK, LINIGER ERIC GERHARD, ECKERT ANDREW ROBERT, HAY JOHN C
Year of Publication 31.10.2002
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Year of Publication 31.10.2002
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Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density
SIMONYI EVA ERIKA, HEDRICK JEFFREY CURTIS, LEE KANG-WOOK, LINIGER ERIC GERHARD, ECKERT ANDREW ROBERT, HAY JOHN C
Year of Publication 24.09.2002
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Year of Publication 24.09.2002
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METHOD OF FABRICATING LOW-DIELECTRIC CONSTANT INTERLEVEL DIELECTRIC FILMS FOR BEOL INTERCONNECTS WITH ENHANCED ADHESION AND LOW-DEFECT DENSITY
HEDRICK, JEFFREY, CURTIS, ECKERT, ANDREW, ROBERT, HAY, JOHN, C, LEE, KANG-WOOK, SIMONYI, EVA, ERIKA, LINIGER, ERIC, GERHARD
Year of Publication 06.09.2002
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Year of Publication 06.09.2002
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Chip crack stop
WHITESIDE, RICHARD CHARLES, COOK, ROBERT FRANCIS, LINIGER, ERIC GERHARD, MENDELSON,RONALD LEE
Year of Publication 21.02.2000
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Year of Publication 21.02.2000
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Chip crack stop
COOK; ROBERT FRANCIS, LINIGER; ERIC GERHARD, MENDELSON; RONALD LEE, WHITESIDE; RICHARD CHARLES
Year of Publication 08.02.2000
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Year of Publication 08.02.2000
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Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information
BLONDIN JOHN M, BROUILLETTE DONALD W, COOK ROBERT FRANCIS, LINIGER ERIC GERHARD, MENDELSON RONALD LEE, DIEFENDERFER DAVID FREDERICK
Year of Publication 09.01.2001
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Year of Publication 09.01.2001
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Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information
DIEFENDERFER; DAVID FREDERICK, COOK; ROBERT FRANCIS, LINIGER; ERIC GERHARD, MENDELSON; RONALD LEE, BLONDIN; JOHN M, BROUILLETTE; DONALD W
Year of Publication 30.03.1999
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Year of Publication 30.03.1999
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Process for manufacture of integrated circuit device
CARTER KENNETH RAYMOND, HAWKER CRAIG JON, YOON DO YEUNG, HARBISON MARTHA ALYNE, HEDRICK JAMES LUPTON, VOLKSEN WILLI, COOK ROBERT FRANCES, LEE VICTOR YEE-WAY, LINIGER ERIC GERHARD, MILLER ROBERT DENNIS
Year of Publication 23.01.2001
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Year of Publication 23.01.2001
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Process for manufacture of integrated circuit device
VOLKSEN; WILLI, KIM; SUNG-MOG, COOK; ROBERT FRANCIS, CARTER; KENNETH RAYMOND, LINIGER; ERIC GERHARD, HEDRICK; JAMES LUPTON, MILLER; ROBERT DENNIS, HARBISON; MARTHA ALYNE, HAWKER; CRAIG JON, YOON; DO YEUNG
Year of Publication 14.09.1999
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Year of Publication 14.09.1999
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