Residual Clamping Force and Dynamic Random Access Memory Data Retention Improved by Gate Tungsten Etch Dechucking Condition in a Bipolar Electrostatic Chuck
Lee, Chung-Yuan, Lai, Chao-Sung, Yang, Chia-Ming, Wang, David HL, Lin, Betty, Lee, Siimon, Huang, Chi-Hung, Wei, Chen Chang
Published in Japanese Journal of Applied Physics (01.08.2012)
Published in Japanese Journal of Applied Physics (01.08.2012)
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CHIP PACKAGE DEVICE AND ITS POSITIONING PRESSURE-CONTACT METHOD
YANG CHIA MING, HSIEH PO TSUNG, CHUANG YA WEN, TSENG SHIH WEN, CHEN IN GANN, TSAI YA WEN
Year of Publication 21.05.2020
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Year of Publication 21.05.2020
Patent