Thermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologies
Vandevelde, B., Okoro, C., Gonzalez, M., Swinnen, B., Beyne, E.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
A multilayer PCB material modeling approach based on laminate theory
Rzepka, S., Kramer, F., Grassme, O., Lienig, J.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Get full text
Conference Proceeding