GIGA-INTERPOSER-INTEGRATION DURCH CHIP-ON-WAFER-ON-SUBSTRAT UND VERFAHREN ZUR BILDUNG VON CHIP-ON-WAFER-ON-SUBSTRATE-PAKETEN
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Year of Publication 14.07.2022
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Year of Publication 14.07.2022
Patent
GIGA-INTERPOSER-INTEGRATION DURCH CHIP-ON-WAFER-ON-SUBSTRAT
Huang, Ping-Kang, Hou, Shang-Yun, Chiu, Sao-Ling, Yu, Chen-Hua, Lu, Szu-Wei, Wei, Wen-Hsin, Chiou, Wen-Chih, Wu, Chi-Hsi, Shen, Chih-Ta, Hu, Hsien-Pin, Shih, Ying-Ching
Year of Publication 25.11.2021
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Year of Publication 25.11.2021
Patent