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Search Results - "LIAO XIAOJING"
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"LIAO XIAOJING"
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PACKAGING DEVICE, POWER MODULE, AND ELECTRONIC DEVICE
by
LIAO
,
Xiaojing
Year of Publication
07.08.2024
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PACKAGE STRUCTURE AND ELECTRONIC DEVICE
by
Liao
,
Xiaojing
Year of Publication
10.04.2024
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PACKAGE STRUCTURE AND PACKAGE SYSTEM
by
PENG, Hao
,
LIAO
,
Xiaojing
Year of Publication
05.07.2023
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POWER SUPPLY MODULE AND POWER DEVICE
by
Peng, Hao
,
Liao
,
Xiaojing
Year of Publication
01.02.2023
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PACKAGE STRUCTURE AND PACKAGE SYSTEM
by
PENG, Hao
,
LIAO
,
Xiaojing
Year of Publication
18.01.2023
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CHIP PACKAGE ASSEMBLY AND ELECTRONIC DEVICE COMPRISING THE CHIP PACKAGE ASSEMBLY
by
HOU, Zhaozheng
,
PENG, Hao
,
LIAO
,
Xiaojing
Year of Publication
20.03.2024
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EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
by
SHEN, Chao
,
LIAO
,
Xiaojing
,
XIANG, Zhiqiang
Year of Publication
19.07.2023
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CHIP PACKAGE ASSEMBLY AND ELECTRONIC DEVICE COMPRISING THE CHIP PACKAGE ASSEMBLY
by
HOU, Zhaozheng
,
PENG, Hao
,
LIAO
,
Xiaojing
Year of Publication
01.02.2023
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EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
by
SHEN, Chao
,
LIAO
,
Xiaojing
,
XIANG, Zhiqiang
Year of Publication
04.01.2023
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PACKAGE SUBSTRATE AND COMMUNICATION DEVICE
by
SHEN, Chao
,
KANG, Chen
,
LIAO
,
Xiaojing
,
WANG, Junhe
Year of Publication
12.06.2024
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PRINTED CIRCUIT BOARD
by
HOU, Zhaozheng
,
SHEN, Chao
,
WANG, Dongxing
,
LIAO
,
Xiaojing
Year of Publication
15.05.2024
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PACKAGE SUBSTRATE AND COMMUNICATION DEVICE
by
SHEN, Chao
,
KANG, Chen
,
LIAO
,
Xiaojing
,
WANG, Junhe
Year of Publication
20.09.2023
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WIRELESS TRANSMISSION MODULE AND FABRICATION METHOD THEREFOR
by
HE, Qijing
,
HOU, Zhaozheng
,
LIAO
,
Xiaojing
Year of Publication
18.01.2023
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PRINTED CIRCUIT BOARD
by
HOU, Zhaozheng
,
SHEN, Chao
,
WANG, Dongxing
,
LIAO
,
Xiaojing
Year of Publication
29.06.2022
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WIRELESS TRANSMISSION MODULE AND FABRICATION METHOD THEREFOR
by
HE, Qijing
,
HOU, Zhaozheng
,
LIAO
,
Xiaojing
Year of Publication
21.07.2021
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WIRELESS TRANSMISSION MODULE AND FABRICATION METHOD THEREFOR
by
HE, Qijing
,
HOU, Zhaozheng
,
LIAO
,
Xiaojing
Year of Publication
24.03.2021
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Durch Ätzen vor dem Einhausen hergestellter dreidimensionaler metallischer Leiterplattenaufbau mit umgekehrt aufgesetztem Chip auf Systemebene und technologisches Verfahren
by
Zhang, Kai
,
Wang, Yaqin
,
Zhang, Youhai
,
Wang, Sunyan
,
Liao
,
Xiaojing
Year of Publication
10.10.2019
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Durch Ätzen vor dem Einhausen hergestellter dreidimensionaler metallischer Leiterplattenaufbau mit umgekehrt aufgesetztem Chip auf Systemebene und technologisches Verfahren
by
Zhang, Kai
,
Wang, Yaqin
,
Zhang, Youhai
,
Wang, Sunyan
,
Liao
,
Xiaojing
Year of Publication
19.05.2016
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