Connecting structure used in the production of a semiconductor chip support comprises a support material, a metallic through-hole arranged in the carrier material, a re-distributing layer, and a through-contact
DOWNES, FRANCIS J, ALCOE, DAVID J, TYTRAN-PALOMAKI, CHERYL L, KRESGE, JOHN S, JONES, GERALD W
Year of Publication 20.12.2001
Get full text
Year of Publication 20.12.2001
Patent