CHROMIUM ADHESION LAYER FOR COPPER VIAS IN LOW-K TECHNOLOGY
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Year of Publication 13.05.2009
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Method for bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structures
CHEN, TZEIANG, ENGEL, BRETT, H, SEO, SOONON, FITZSIMMONS, JOHN, A, KANE, TERENCE, WANG, YUN, YU, LUSTIG, NAFTALI, E, STAMPER, ANTHONY, K, KALTALIOGLU, ERDEM, MCDONALD, ANN, MCGAHAY, VINCENT
Year of Publication 28.12.2011
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Year of Publication 28.12.2011
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CHROMIUM ADHESION LAYER FOR COPPER VIAS IN LOW-K TECHNOLOGY
ENGEL, BRETT, H, SEO, SOONON, WANG, YUN-YU, WONG, HON WONG, MILLER, JOHN, A, HOINKIS, MARK
Year of Publication 29.10.2003
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Year of Publication 29.10.2003
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BILAYER HDP CVD / PE CVD CAP IN ADVANCED BEOL INTERCONNECT STRUCTURES AND METHOD THEREOF
CHEN, TZEIANG, ENGEL, BRETT, H, SEO, SOONON, FITZSIMMONS, JOHN, A, KANE, TERENCE, WANG, YUN, YU, LUSTIG, NAFTALI, E, STAMPER, ANTHONY, K, KALTALIOGLU, ERDEM, MCDONALD, ANN, MCGAHAY, VINCENT
Year of Publication 20.07.2005
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Year of Publication 20.07.2005
Patent
Method for bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structures
CHEN, TZEIANG, ENGEL, BRETT, H, SEO, SOONON, FITZSIMMONS, JOHN, A, KANE, TERENCE, WANG, YUN, YU, LUSTIG, NAFTALI, E, STAMPER, ANTHONY, K, KALTALIOGLU, ERDEM, MCDONALD, ANN, MCGAHAY, VINCENT
Year of Publication 27.10.2004
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Year of Publication 27.10.2004
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