SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
KENG, TAN TEIK, WU, CHUNG-LIN, CHOI, YOONHWA, GOOI, BOON HUAN, LIM, LAY YEAP, LEE, BUYONG-OK, JEON, OSEOB, JOSHI, RAJEEV, IYER, VENKAT, CHONG, DAVID, ESTACIO, MARIA, CRISTINA, B, NAM, SHIBAEK
Year of Publication 19.04.2007
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Year of Publication 19.04.2007
Patent
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
KENG, TAN TEIK, WU, CHUNG-LIN, CHOI, YOONHWA, GOOI, BOON HUAN, LIM, LAY YEAP, LEE, BUYONG-OK, JEON, OSEOB, JOSHI, RAJEEV, IYER, VENKAT, CHONG, DAVID, ESTACIO, MARIA, CRISTINA, B, NAM, SHIBAEK
Year of Publication 11.01.2007
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Year of Publication 11.01.2007
Patent