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Year of Publication 08.05.2019
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Year of Publication 17.09.2014
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INTERCONNECT STRUCTURE FOR INTEGRATED CIRCUITS HAVING IMPROVED ELECTROMIGRATION CHARACTERISTICS AND METHOD OF MAKING SUCH STRUCTURE
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Year of Publication 16.02.2011
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STRUCTURE AND METHOD OF FORMING ELECTRICALLY BLOWN METAL FUSES FOR INTEGRATED CIRCUITS
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Year of Publication 28.03.2012
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Year of Publication 28.03.2012
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STRUCTURE AND METHOD OF FORMING ELECTRICALLY BLOWN METAL FUSES FOR INTEGRATED CIRCUITS
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Year of Publication 25.11.2010
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Year of Publication 25.11.2010
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Copper interconnection structure incorporating a metal seed layer
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Year of Publication 18.01.2006
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Year of Publication 18.01.2006
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REDUCED ELECTROMIGRATION AND STRESS INDUCED MIGRATION OF CU WIRES BY SURFACE COATING
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Year of Publication 05.06.2002
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Year of Publication 05.06.2002
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REDUCED ELECTROMIGRATION AND STRESS INDUCED MIGRATION OF Cu WIRES BY SURFACE COATING
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Year of Publication 01.02.2001
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Year of Publication 01.02.2001
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