THERMAL ETCHING OF RUTHENIUM
YU, Kai-Hung, WAJDA, Cory, PATTANAIK, Gyanaranjan, LEUSINK, Gerrit, CLARK, Robert, TAPILY, Kandabara, HIGUCHI, Hisashi
Year of Publication 16.05.2024
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Year of Publication 16.05.2024
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SELECTIVE INHIBITION FOR SELECTIVE METAL DEPOSITION
YU, Kai-Hung, WAJDA, Cory, SUZUKI, Hidenao, CLARK, Robert, YONEZAWA, Ryota, NIIMI, Hiroaki, TAPILY, Kandabara, MIYAHARA, Takahiro
Year of Publication 31.08.2023
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Year of Publication 31.08.2023
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METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH A LOW-RESISTIVITY METAL
YU, Kai-Hung, WAJDA, Cory, LEUSINK, Gerrit J, O'MEARA, David L, AIZAWA, Hirokazu, ZANDI, Omid, HIGUCHI, Hisashi
Year of Publication 12.05.2022
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Year of Publication 12.05.2022
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METHOD FOR CONTROLLING THE FORMING VOLTAGE IN RESISTIVE RANDOM ACCESS MEMORY DEVICES
WAJDA, Cory, TSUNOMURA, Takaaki, ANDO, Takashi, HOPSTAKEN, Marinus J, NARAYANAN, Vijay, TAPILY, Kandabara, CONSIGLIO, Steven, JAMISON, Paul, CARTIER, Eduard Albert
Year of Publication 03.12.2020
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Year of Publication 03.12.2020
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METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH A LOW-RESISTIVITY METAL
YU, Kai-Hung, WAJDA, Cory, LEUSINK, Gerrit J, CLARK, Robert D, PATTANAIK, Gyanaranjan, TRICKETT, Ying, HAN, Yun, LIU, Eric Chih-Fang, NIIMI, Hiroaki, ZHANG, Henan, CHANG, Shihsheng
Year of Publication 22.09.2022
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Year of Publication 22.09.2022
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RUTHENIUM METAL FEATURE FILL FOR INTERCONNECTS
YU, Kai-Hung, LIU, Eric, WAJDA, Cory, ROSENTHAL, David, LEUSINK, Gerrit, IGETA, Masanobu, O'MEARA, David, JOY, Nicholas
Year of Publication 11.04.2019
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Year of Publication 11.04.2019
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RUTHENIUM METAL DEPOSITION METHOD FOR ELECTRICAL CONNECTIONS
YU, Kai-Hung, ISHIZAKA, Tadahiro, LEUSINK, Gerrit J, WAJDA, Cory, HAKAMATA, Takahiro
Year of Publication 24.08.2017
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Year of Publication 24.08.2017
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METHOD OF CORNER ROUNDING AND TRIMMING OF NANOWIRES BY MICROWAVE PLASMA
TAPILY, Kandabara N, WAJDA, Cory, LEUSINK, Gerrit J, MAEKAWA, Kaoru, TRICKETT, Ying, TAMURA, Chihiro
Year of Publication 11.05.2017
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Year of Publication 11.05.2017
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GERMANIUM-CONTAINING SEMICONDUCTOR DEVICE AND METHOD OF FORMING
TAPILY, Kandabara N, CONSIGLIO, Steven P, WAJDA, Cory, LEUSINK, Gerrit J, CLARK, Robert D
Year of Publication 23.03.2017
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Year of Publication 23.03.2017
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RUTHENIUM METAL FEATURE FILL FOR INTERCONNECTS
YU, Kai-Hung, ISHIZAKA, Tadahiro, LEUSINK, Gerrit J, WAJDA, Cory, HAKAMATA, Takahiro
Year of Publication 08.12.2016
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Year of Publication 08.12.2016
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INTEGRATION OF ALD BARRIER LAYER AND CVD Ru LINER FOR VOID-FREE Cu FILLING
HASEGAWA, TOSHIO, ISHIZAKA, TADAHIRO, CONSIGLIO, STEVEN, YU, KAI-HUNG, OIE, MANABU, AMANO, FUMITAKA, LEUSINK, GERT J, WAJDA, CORY, MAEKAWA, KAORU
Year of Publication 06.08.2015
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Year of Publication 06.08.2015
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