ENHANCED THERMAL MANAGEMENT OF 3-D STACKED DIE PACKAGING
MOTSCHMAN, DAVID, R, WAKIL, JAMIL, A, SIKKA, KAMAL, K, ZHENG, JIANTAO, WEI, XIAOJIN, BARTLEY, GERALD, K
Year of Publication 19.04.2012
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Year of Publication 19.04.2012
Patent
ENHANCED THERMAL MANAGEMENT OF 3-D STACKED DIE PACKAGING
MOTSCHMAN, DAVID, R, WAKIL, JAMIL, A, SIKKA, KAMAL, K, ZHENG, JIANTAO, WEI, XIAOJIN, BARTLEY, GERALD, K
Year of Publication 12.01.2012
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Year of Publication 12.01.2012
Patent