An efficient lid design for cooling stacked flip-chip 3D packages
Sikka, K., Wakil, J., Toy, H., Hsichang Liu
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
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Conference Proceeding
A Practical Implementation of Silicon Microchannel Coolers for High Power Chips
Colgan, E.G., Furman, B., Gaynes, M., Graham, W.S., LaBianca, N.C., Magerlein, J.H., Polastre, R.J., Rothwell, M.B., Bezama, R.J., Choudhary, R., Marston, K.C., Toy, H., Wakil, J., Zitz, J.A., Schmidt, R.R.
Published in IEEE transactions on components and packaging technologies (01.06.2007)
Published in IEEE transactions on components and packaging technologies (01.06.2007)
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Journal Article
Electronic package structure with offset stacked chips and top and bottom side cooling lid
Sikka, Kamal K, Bonam, Ravi K, Li, Shidong, Sakuma, Katsuyuki, Toy, Hilton T
Year of Publication 30.01.2024
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Year of Publication 30.01.2024
Patent
Electronic Package Structure With Offset Stacked Chips And Top And Bottom Side Cooling Lid
Sikka, Kamal K, Bonam, Ravi K, Li, Shidong, Sakuma, Katsuyuki, Toy, Hilton T
Year of Publication 22.06.2023
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Year of Publication 22.06.2023
Patent
Mitigating cooldown peeling stress during chip package assembly
Tunga, Krishna R, Farooq, Mukta Ghate, Sakuma, Katsuyuki, Toy, Hilton T
Year of Publication 03.01.2023
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Year of Publication 03.01.2023
Patent
Lid/heat spreader having targeted flexibility
Li, Shidong, Bunt, Jay A, Toy, Hilton, Zhang, Hongqing, Lewison, David J, Marston, Kenneth C
Year of Publication 30.08.2022
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Year of Publication 30.08.2022
Patent
MITIGATING COOLDOWN PEELING STRESS DURING CHIP PACKAGE ASSEMBLY
Tunga, Krishna R, Farooq, Mukta Ghate, Sakuma, Katsuyuki, Toy, Hilton T
Year of Publication 30.06.2022
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Year of Publication 30.06.2022
Patent
Laminated stiffener to control the warpage of electronic chip carriers
Sikka, Kamal K, Iruvanti, Sushumna, Tunga, Krishna R, Li, Shidong, Weiss, Thomas, Toy, Hilton T
Year of Publication 12.04.2022
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Year of Publication 12.04.2022
Patent
Pluggable LGA socket for high density interconnects
Benner, Alan F, Fasano, Benjamin Vito, Toy, Hilton T, Fortier, Paul Francis
Year of Publication 12.10.2021
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Year of Publication 12.10.2021
Patent
LID/HEAT SPREADER HAVING TARGETED FLEXIBILITY
BUNT, JAY A, TOY, HILTON, ZHANG, HONGQING, MARSTON, KENNETH C, LI, SHIDONG, LEWISON, DAVID J
Year of Publication 29.07.2021
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Year of Publication 29.07.2021
Patent
Multi integrated circuit chip carrier package
Sikka, Kamal K, Interrante, Marcus E, Sinha, Tuhin, Zitz, Jeffrey A, Toy, Hilton T, Lange, Kathryn R
Year of Publication 13.04.2021
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Year of Publication 13.04.2021
Patent
Method of forming an electronic package
Sikka, Kamal K, Iruvanti, Sushumna, Tunga, Krishna R, Li, Shidong, Weiss, Thomas, Toy, Hilton T
Year of Publication 28.04.2020
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Year of Publication 28.04.2020
Patent
Lid attach optimization to limit electronic package warpage
Sikka, Kamal K, Iruvanti, Sushumna, Li, Shidong, Zitz, Jeffrey A, Toy, Hilton T
Year of Publication 17.03.2020
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Year of Publication 17.03.2020
Patent
Cooling structure for electronic boards
Sikka, Kamal K, Werner, Randall J, Bodenweber, Paul F, Zitz, Jeffrey A, Toy, Hilton T, Marston, Kenneth C
Year of Publication 26.01.2021
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Year of Publication 26.01.2021
Patent
LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS
Sikka, Kamal K, Iruvanti, Sushumna, Tunga, Krishna R, Li, Shidong, Weiss, Thomas, Toy, Hilton T
Year of Publication 09.01.2020
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Year of Publication 09.01.2020
Patent
Cooling structure for electronic boards
Sikka, Kamal K, Werner, Randall J, Bodenweber, Paul F, Zitz, Jeffrey A, Toy, Hilton T, Marston, Kenneth C
Year of Publication 25.08.2020
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Year of Publication 25.08.2020
Patent