Search Results - "THIEL, GEORGE, H" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Reliability Characterization of a Flexible Interconnect for Cryogenic and Quantum Applications

Reliability Characterization of a Flexible Interconnect for Cryogenic and Quantum Applications

by Schmidgall, Emma R., Griggio, Flavio, Thiel, George H., Peek, Sherman E., Yelamanchili, Bhargav, Shah, Archit, Gupta, Vaibhav, Sellers, John A., Hamilton, Michael C., Tuckerman, David B., d'Hollosy, Samuel
Published in 2021 IEEE International Reliability Physics Symposium (IRPS) (01.03.2021)

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Conference Proceeding

Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates

Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates

by KORHONEN, Tia-Marje K, TURPEINEN, Pekka, LEHMAN, Lawrence P, BOWMAN, Brian, THIEL, George H, PARKES, Raymond C, KORHONEN, Matt A, HENDERSON, Donald W, PUTTLITZ, Karl J
Published in Journal of electronic materials (01.12.2004)

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Conference Proceeding Journal Article

NON-PLANAR SURFACE FOR SEMICONDUCTOR CHIPS AND METHOD OF FORMING THE NON-PLANAR SEMICONDUCTOR CHIP

NON-PLANAR SURFACE FOR SEMICONDUCTOR CHIPS AND METHOD OF FORMING THE NON-PLANAR SEMICONDUCTOR CHIP

by BRODSKY WILLIAM L, SATHE SANJEEV B, THIEL GEORGE H
Year of Publication 07.07.2001

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Patent

Method and structure for self healing cracks in under-fill material between an I/C chip and a substrate bonded together with solder balls

Method and structure for self healing cracks in under-fill material between an I/C chip and a substrate bonded together with solder balls

by THIEL GEORGE H
Year of Publication 06.06.2007

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Patent

Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls

Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls

by Thiel, George H
Year of Publication 16.05.2006

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Patent

Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls

Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls

by THIEL GEORGE H
Year of Publication 16.05.2006

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Patent

Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls

Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls

by THIEL GEORGE H
Year of Publication 21.04.2005

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Patent

Method and structure for self healing cracks in underfill material between an i/c chip and a substrate bonded together with solder balls

Method and structure for self healing cracks in underfill material between an i/c chip and a substrate bonded together with solder balls

by THIEL GEORGE H
Year of Publication 20.04.2005

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Patent

HEAT EXCHANGER HAVING TEMPERATURE-ACTUATED VALVES

HEAT EXCHANGER HAVING TEMPERATURE-ACTUATED VALVES

by FOY BRIAN W, THIEL GEORGE H
Year of Publication 13.08.2009

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Patent

A finite element for the linear analysis of laminated circular plates

A finite element for the linear analysis of laminated circular plates

by Thiel, George H., Miller, Robert E.
Published in Composite structures (1994)

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Journal Article

A finite element for the nonlinear analysis of laminated circular plates

A finite element for the nonlinear analysis of laminated circular plates

by Thiel, George H., Miller, Robert E.
Published in Composite structures (1994)

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Journal Article

Non-planar surface for semiconductor chips

Non-planar surface for semiconductor chips

by BRODSKY WILLIAM L, SATHE SANJEEV B, THIEL GEORGE H
Year of Publication 02.05.2006

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Patent

Non-planar surface for semiconductor chips

Non-planar surface for semiconductor chips

by Brodsky, William L, Sathe, Sanjeev B, Thiel, George H
Year of Publication 02.05.2006

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Patent

HIGH PERFORMANCE CHIP PACKAGING METHOD

HIGH PERFORMANCE CHIP PACKAGING METHOD

by KISHOR V DESAI, TIMOTHY F CARDEN, RANDALL STUTZMAN, GEORGE H THIEL, GLENN O DEARING, STEPHEN R ENGLE
Year of Publication 28.08.2009

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Patent

Non-planar surface for semiconductor chips

Non-planar surface for semiconductor chips

by SANJEEV B SATHE, WILLIAM L BRODSKY, GEORGE H THIEL
Year of Publication 25.08.2004

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Patent

NON-PLANAR SURFACE FOR SEMICONDUCTOR CHIPS AND METHOD OF FORMING THE NON-PLANAR SEMICONDUCTOR CHIP

NON-PLANAR SURFACE FOR SEMICONDUCTOR CHIPS AND METHOD OF FORMING THE NON-PLANAR SEMICONDUCTOR CHIP

by SANJEEV B. SATHE, WILLIAM L. BRODSKY, GEORGE H. THIEL
Year of Publication 30.07.2004

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Patent

Non-planar surface for semiconductor chips

Non-planar surface for semiconductor chips

by BRODSKY WILLIAM L, SATHE SANJEEV B, THIEL GEORGE H
Year of Publication 22.07.2004

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Patent

Non-planar surface for semiconductor chips

Non-planar surface for semiconductor chips

by BRODSKY WILLIAM L, SATHE SANJEEV B, THIEL GEORGE H
Year of Publication 04.05.2004

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Patent

Non-planar surface for semiconductor chips

Non-planar surface for semiconductor chips

by Brodsky, William L, Sathe, Sanjeev B, Thiel, George H
Year of Publication 04.05.2004

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Patent

Structure to accommodate increase in volume expansion during solder reflow

Structure to accommodate increase in volume expansion during solder reflow

by CALETKA DAVID V, HENDERSON DONALD W, LEHMAN LAWRENCE P, DARBHA KRISHNA, THIEL GEORGE H
Year of Publication 21.09.2006

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Patent