Workability and reliability assessment of various high bandwidth PoP structures
Hung, Mike, Huang, Louie, Lin, Timmy, Chen, Eting, Huang, Edward, Ding, Y. C.
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Advanced QFN packaging with trace routing design
Lu, C.T., Tsai, H.Y., Chen, Eting, Lin, Timmy, Huang, Louie, Hung, Mike, Chen, S. J.
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
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Conference Proceeding
Electrical, thermal and warpage investigation on high bandwidth PoP
Hung, Mike, Chang-Chi Lee, Hung-Hsiang Cheng, Cheng, Morris, Lin, Timmy, Ying-Chih Lee, Chin-Li Kao, Po-Chih Pan
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Embedded component substrates moving forward
Appelt, B. K., Su, B., Lee, D., Yen, U., Hung, M.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Low cost fcCSP based on cu pillar
Appelt, B. K., Chung, H., Chienfan Chen, Wang, R., Hung, M.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
BGA assembly process development for 45nm ELK CUP devices
Tseng, A., Lin, B., Huang, L., Hung, M.
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
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Conference Proceeding
Mold array package for POP applications
Aching Lee, Louie Huang, Hung, M.
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
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Conference Proceeding
TEMPORAL SEQUENCE ALIGNMENT METHOD FOR GESTURE TRAINING DATA
KUO, Chun-Hsuan, HWANG, Wen-Jyi, WANG, Mike Chun-Hung, WANG, Hung-Ju, TAI, Tsung-Ming
Year of Publication 12.10.2023
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Year of Publication 12.10.2023
Patent
Radar system with self-interference cancelling function
Lin, Chen-Lun, Cheng, Wen-Sheng, Khalil, Mohammad Athar, Wang, Mike Chun-Hung, Kuo, Chun-Hsuan, Kung, Ming Wei, Le, Khoi Duc, Kuo, Chin-Wei
Year of Publication 19.03.2024
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Year of Publication 19.03.2024
Patent