by Henderson, Donald W., Gosselin, Timothy, Sarkhel, Amit, Kang, Sung K., Choi, Won-Kyoung, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.11.2002)

by Kang, S. K., Lauro, P., Shih, D.-Y., Henderson, D. W., Puttlitz, K. J.
Published in IBM journal of research and development (01.07.2005)

by KORHONEN, Tia-Marje K, LEHMAN, Lawrence P, KORHONEN, Matt A, HENDERSON, Donald W
Published in Journal of electronic materials (01.02.2007)

by Kang, Sung K., Shih, Da-Yuan, Leonard, Donovan, Henderson, Donald W., Gosselin, Timothy, Cho, Sung-il, Yu, Jin, Choi, Won K.
Published in JOM (1989) (01.06.2004)

by Yihua Liu, Liang Yin, Bliznakov, S., Kondos, P., Borgesen, P., Henderson, D.W., Parks, C., Ju Wang, Cotts, E.J., Dimitrov, N.
Published in IEEE transactions on components and packaging technologies (01.03.2010)

by KORHONEN, Tia-Marje K, TURPEINEN, Pekka, LEHMAN, Lawrence P, BOWMAN, Brian, THIEL, George H, PARKES, Raymond C, KORHONEN, Matt A, HENDERSON, Donald W, PUTTLITZ, Karl J
Published in Journal of electronic materials (01.12.2004)

by Kang, S.K., Shih, D.Y., Fogel, K., Lauro, P., Myung-Jin Yim, Advocate, G.G., Griffin, M., Goldsmith, C., Henderson, D.W., Gosselin, T.A., King, D.E., Konrad, J.J., Sarkhel, A., Puttlitz, K.J.
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)

by HENDERSON DONALD W, SPALIK JAMES
Year of Publication 04.07.2001

by Henderson, Donald W., Woods, James J., Gosselin, Timothy A., Bartelo, Jay, King, David E., Korhonen, T.M., Korhonen, M.A., Lehman, L.P., Cotts, E.J., Kang, Sung K., Lauro, Paul, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.06.2004)

by Liang Yin, Kondos, P., Borgesen, P., Yihua Liu, Bliznakov, S., Wafula, F., Dimitrov, N., Henderson, D.W., Parks, C., Mao Gao, Therriault, J., Ju Wang, Cotts, E.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)

by Kang, Sung K., Shih, Da-Yuan, Donald, NY, Henderson, W., Gosselin, Timothy, Sarkhel, Amit, Charles Goldsmith, NY, Puttlitz, Karl J., Choi, Won Kyoung
Published in JOM (1989) (01.06.2003)

by Kang, S.K., Lauro, P., Da-Yuan Shih, Henderson, D.W., Gosselin, T., Bartelo, J., Cain, S.R., Goldsmith, C., Puttlitz, K.J., Tae-Kyung Hwang
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)

by Korhonen, Tia-Marje K, Lehman, Lawrence P, Korhonen, Matt A, Henderson, Donald W
Published in Journal of electronic materials (01.02.2007)

by Kang, Sung K, Da-Yuan, Shih, Donovan, Leonard, Henderson, Donald W
Published in JOM (1989) (01.06.2004)

by Kang, Sung K, Shih, Da-Yuan, Leonard, Donovan, Henderson, Donald W
Published in JOM (1989) (01.06.2004)

by Kang, Sung K, Choi, Won Kyoung, Da-Yuan, Shih, Henderson, Donald W
Published in JOM (1989) (01.06.2003)

by Henderson, Donald W., Gosselin, Timothy, Sarkhel, Amit, Kang, Sung K., Choi, Won-Kyoung, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.11.2002)

by Lu, M., Lauro, P., Da-Yuan Shih, Polastre, R., Goldsmith, C., Henderson, D.W., Hongqing Zhang, Moon Gi Cho
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)

by de Sousa, I., Henderson, D.W., Parry, L., Kang, S.K., Shih, D.-Y.
Published in 56th Electronic Components and Technology Conference 2006 (2006)

by Borgesen, P., Liang Yin, Kondos, P., Henderson, D.W., Servis, G., Ju Wang, Srihari, K.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)