Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction
Zhang, Yaqian, Du, Leiming, Bäcke, Olof, Kalbfleisch, Sebastian, Zhang, Guoqi, Vollebregt, Sten, Hörnqvist Colliander, Magnus
Published in Applied physics letters (19.02.2024)
Published in Applied physics letters (19.02.2024)
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Journal Article
High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling
Hu, Dong, Qian, Cheng, Liu, Xu, Du, Leiming, Sun, Zhongchao, Fan, Xuejun, Zhang, Guoqi, Fan, Jiajie
Published in Journal of materials research and technology (01.09.2023)
Published in Journal of materials research and technology (01.09.2023)
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Journal Article
Frequency characteristics of weld pool oscillation in pulsed gas tungsten arc welding
Yu, Shi, Chunkai, Li, Leiming, Du, YuFen, Gu, Ming, Zhu
Published in Journal of manufacturing processes (01.10.2016)
Published in Journal of manufacturing processes (01.10.2016)
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Journal Article
Evaluating the electromigration effect on mechanical performance degradation of aluminum interconnection wires: A nanoindentation test with molecular dynamics simulation study
Feng, Shuo, Du, Leiming, Cui, Zhen, Zhu, Xi, Fan, Xuejun, Zhang, Guoqi, Fan, Jiajie
Published in Applied surface science (15.12.2024)
Published in Applied surface science (15.12.2024)
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Journal Article
Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging
Hu, Dong, Du, Leiming, Alfreider, Markus, Fan, Jiajie, Kiener, Daniel, Zhang, Guoqi
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (01.04.2024)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (01.04.2024)
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Journal Article
Effects of inclusion size and stress ratio on the very-high-cycle fatigue behavior of pearlitic steel
Cong, Tao, Qian, Guian, Zhang, Guanzhen, Wu, Si, Pan, Xiangnan, Du, Leiming, Liu, Xiaolong
Published in International journal of fatigue (01.01.2021)
Published in International journal of fatigue (01.01.2021)
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Journal Article
Real-time Measurement of Weld Pool Oscillation Frequency in GTAW-P Process
Li, Chunkai, Shi, Yu, Du, Leiming, Yufen, Gu, Zhu, Ming
Published in Journal of manufacturing processes (01.10.2017)
Published in Journal of manufacturing processes (01.10.2017)
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Journal Article
On estimators of the jet bolometric luminosity of Fermi 2LAC blazars
Wang, Zerui, Xue, Rui, Du, Leiming, Xie, Zhaohua, Xiong, Dingrong, Yi, Tingfeng, Xu, Yunbing, Liu, Wenguang
Published in Astrophysics and space science (01.10.2017)
Published in Astrophysics and space science (01.10.2017)
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Journal Article
The correlations of multi-wave band luminosity and BLR luminosity in Fermi 2LAC blazars
Wang, Zerui, Xue, Rui, Xie, Zhaohua, Du, Leiming, Yi, Tingfeng, Xu, Yunbing, Liu, Wenguang
Published in Astrophysics and space science (01.10.2017)
Published in Astrophysics and space science (01.10.2017)
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Journal Article
Frequency characteristics of weld pool oscillation in pulsed gas tungsten arc weldin
Yu, Shi, Chunkai, Li, Leiming, Du, YuFen, Gu, Ming, Zhu
Published in Journal of manufacturing processes (01.10.2016)
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Published in Journal of manufacturing processes (01.10.2016)
Journal Article
Multi-parameters optimization for electromigration in WLCSP solder bumps
Du, Leiming, Deng, Shanliang, Cui, Zhen, Poelma, Rene, Beelen-Hendrikx, Caroline, Zhang, Kouchi
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)
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Conference Proceeding