Effects of Sn grain structure on the electromigration of Sn–Ag solder joints
Wang, Yiwei, Lu, Kuan H., Gupta, Vikas, Stiborek, Leon, Shirley, Dwayne, Chae, Seung-Hyun, Im, Jay, Ho, Paul S.
Published in Journal of materials research (28.04.2012)
Published in Journal of materials research (28.04.2012)
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Journal Article
Characterization of the Viscoelasticity of Molding Compounds in the Time Domain
Chae, Seung-Hyun, Zhao, Jie-Hua, Edwards, Darvin R., Ho, Paul S.
Published in Journal of electronic materials (01.04.2010)
Published in Journal of electronic materials (01.04.2010)
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Journal Article
A Comprehensive Study of Solder Joint Reliability Dependent on Temperature Cycling Profiles and Material Selections with Emphasis on an Improved Solder Fatigue Lifetime Model
Son, Bongchan, Chae, Seung-Hyun, Noh, Seungkwon, Lee, KilJae, Kim, Sangdeok
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
An Unsymmetrically [pi]-Extended Porphyrin-Based Single-Crystal Field-Effect Transistor and Its Anisotropic Carrier-Transport Behavior
Choi, Soojung, Chae, Seung Hyun, Hoang, Mai Ha, Kim, Kyung Hwan, Huh, Jung A, Kim, Youngmee, Kim, Sung-Jin, Choi, Dong Hoon, Lee, Suk Joong
Published in Chemistry : a European journal (11.02.2013)
Published in Chemistry : a European journal (11.02.2013)
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Journal Article
Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages
Chae, Seung-Hyun, Zhang, Xuefeng, Lu, Kuan-Hsun, Chao, Huang-Lin, Ho, Paul S, Ding, Min, Su, Peng, Uehling, Trent, Ramanathan, Lakshmi N
Published in Journal of materials science. Materials in electronics (01.03.2007)
Published in Journal of materials science. Materials in electronics (01.03.2007)
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Journal Article
Kinetic Analysis of Current Enhanced Intermetallic Growth and Its Effect on Electromigration Reliability of Solder Joints
Huang-Lin Chao, Seung-Hyun Chae, Xuefeng Zhang, Kuan-Hsun Lu, Im, J., Ho, P.S.
Published in 2006 IEEE International Reliability Physics Symposium Proceedings (01.03.2006)
Published in 2006 IEEE International Reliability Physics Symposium Proceedings (01.03.2006)
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Conference Proceeding
Mechanism of void formation in Cu post solder joint under electromigration
Min-Young Kim, Liang-Shan Chen, Seung-Hyun Chae, Choong-Un Kim
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect
Yiwei Wang, Seung-Hyun Chae, Dunne, R., Takahashi, Y., Mawatari, K., Steinmann, P., Bonifield, T., Tengfei Jiang, Im, J., Ho, P. S.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Citral-based polymer containing sulfur and preparation method thereof
KIM DONG GYUN, KIM YONG SEOK, YOO YOUNG JAE, NOH GUK YUN, CHAE SEUNG HYUN, KIM BYOUNG GAK
Year of Publication 19.09.2018
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Year of Publication 19.09.2018
Patent
Investigation of Intermetallic Compound Growth Enhanced by Electromigration in Pb-Free Solder Joints
Seung-Hyun Chae, Chao, B., Xuefeng Zhang, Im, J., Ho, P.S.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding