Impulse Pressuring Diffusion Bonding of TiC Cermet to Stainless Steel Using Ti/Nb Interlayer
Li, Jia, Sheng, Guang-min, Huang, Li
Published in Cai liao gong cheng = Journal of materials engineering (20.03.2017)
Published in Cai liao gong cheng = Journal of materials engineering (20.03.2017)
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Journal Article
Diffusion Bonding of TiC Cermet/304SS with Ti/Nb/Cu Relief Interlayers
Li, Jia, Sheng, Guang-Min
Published in Cai liao gong cheng = Journal of materials engineering (01.12.2014)
Published in Cai liao gong cheng = Journal of materials engineering (01.12.2014)
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Journal Article