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Year of Publication 02.06.2004
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Ti liner for copper interconnect with low-k dielectric
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Year of Publication 01.09.2004
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Year of Publication 01.09.2004
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Structure and method for reducing thermo-mechanical stress in stacked vias
VOLANT, RICHARD P, DALTON, TIMOTHY J, PETRARCA, KEVIN S, HERBST, BRIAN W, MELVILLE, IAN D, ENGEL, BRETT H, MCGAHAY, VINCENT J, MARTIN, ARTHUR, NARAYAN, CHANDRASEKHAR, MALONE, KELLY, MARINO, JEFFREY R, DAS, SANJIT K, KASTENMEIER, BERND E, HICHRI, HABIB
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Year of Publication 01.03.2005
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