Method of fabricating low-dielectric constant interlevel dielectric films for beol interconnects with enhanced adhesion and low-defect density
SIMONYI EVA ERIKA, HEDRICK JEFFREY CURTIS, LEE KANG-WOOK, LINIGER ERIC GERHARD, ECKERT ANDREW ROBERT, HAY JOHN C
Year of Publication 24.11.2004
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Year of Publication 24.11.2004
Patent