A method for depositing a metal layer on a semiconductor interconnect structure having a capping layer
CLEVENGER, LARRY, DALTON, TIMOTHY J, SEO, SOONON, WANG, YUN-YU, TULIPE, DOUGLAS C. LA, KALDOR, STEFFEN K, KUMAR, KAUSHIK, HOINKIS, MARK, YANG, CHIH CHAO, SIMON, ANDREW H, YANG, HAINING
Year of Publication 16.11.2004
Get full text
Year of Publication 16.11.2004
Patent
Copper recess process with application to selective capping and electroless plating
DAVIS, KENNETH M, DALTON, TIMOTHY J, SAENGER, KATHERINE L, MALHOTRA, SANDRA G, TSENG, WEI-TSU, JAMIN, FEN F, KALDOR, STEFFEN K, SMITH, SEAN P.E, HU, CHAO-KUN, NARAYAN, CHANDRASEKHAR, RUBINO, JUDITH M, KRISHNAN, MAHADEVAIYER, LOFARO, MICHAEL F, CHEN, SHYNG-TSONG, RATH, DAVID L, KUMAR, KAUSHIK, SIMON, ANDREW H
Year of Publication 16.10.2004
Get full text
Year of Publication 16.10.2004
Patent