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Year of Publication 01.06.2013
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Dual-damascene process to fabricate thick wire structure
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Year of Publication 26.09.2012
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Year of Publication 11.06.2012
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FEOL/MEOL metal resistor for high end CMOS and method for integrating the resistor
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Year of Publication 09.11.2011
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Year of Publication 21.11.2012
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Silicided trench contact to buried conductive layer
LIU XUEFENG, SHERIDAN DAVID C, JOHNSON JEFFREY B, ORNER BRADLEY A, COOLBAUGH DOUGLAS D, RASSEL ROBERT M, LINDGREN PETER J, NAKOS JAMES S
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Year of Publication 27.11.2013
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Interdigitated vertical parallel capacitor
BOOTH JR. ROGER A, COOLBAUGH DOUGLAS D, HE ZHONG-XIANG, ESHUN EBENEZER E
Year of Publication 23.05.2012
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Year of Publication 23.05.2012
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Interdigitated vertical parallel capacitor
HE, ZHONG-XIANG, BOOTH, ROGER A. JR, COOLBAUGH, DOUGLAS D, ESHUN, EBENEZER E
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Year of Publication 16.11.2011
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Year of Publication 26.12.2012
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Year of Publication 26.12.2012
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Metal gate integration structure and method including metal fuse, anti-fuse and/or resistor
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Year of Publication 01.12.2014
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Year of Publication 01.12.2014
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Silicided trench contact to buried conductive layer
LIU XUEFENG, SHERIDAN DAVID C, JOHNSON JEFFREY B, ORNER BRADLEY A, COOLBAUGH DOUGLAS D, RASSEL ROBERT M, LINDGREN PETER J, NAKOS JAMES S
Year of Publication 05.10.2011
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Year of Publication 05.10.2011
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Dual-damascene process to fabricate thick wire structure
LINDGREN, PETER J, STAMPER, ANTHONY K, DOWNES, KEITH E, COOLBAUGH, DOUGLAS D
Year of Publication 16.02.2008
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Year of Publication 16.02.2008
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