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"Chun-Jung Lin"
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Search Results - "Chun-Jung Lin"
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"Chun-Jung Lin"
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Blockchain-based carbon neutral transaction processing method and system for the same
by
LIN
,
CHUN
-
JUNG
Year of Publication
01.10.2023
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BLOCKCHAIN-BASED CARBON NEUTRAL TRANSACTION PROCESSING METHOD AND SYSTEM FOR THE SAME
by
LIN
,
CHUN JUNG
Year of Publication
21.09.2023
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Method of managing fragmented digital creation and computer program product for the same
by
LIN
,
CHUN
-
JUNG
Year of Publication
01.02.2023
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METHOD OF MANAGING FRAGMENTED DIGITAL CREATION AND COMPUTER PROGRAM PRODUCT FOR THE SAME
by
LIN
,
CHUN JUNG
Year of Publication
21.11.2022
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Rear view device and rear view safety management device of a motorcycle
by
LIN
,
CHUN
-
JUNG
Year of Publication
16.09.2022
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Wafer structure that prevents electromagnetic interference in which a conductive layer is coated on the digital processing unit to isolate electromagnetic interference from adjacent analog processing unit
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
Year of Publication
16.01.2024
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TWI824596B
by
LIN
,
CHUN JUNG
,
GU, RUEI TING
Year of Publication
01.12.2023
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Integrated package with insulation board to replace the multiple printed circuit boards in the traditional package stacking structure to significantly reduce the cost of the stacking structure by using insulation board structure
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
Year of Publication
16.11.2023
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DENTAL CLAMPING APPARATUS AND OPERATING METHOD THEREOF
by
LIN
,
CHUN JUNG
Year of Publication
01.11.2018
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TWI817496B
by
LIN
,
CHUN JUNG
,
GU, RUEI TING
Year of Publication
01.10.2023
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Control circuit device
by
SU, ZHE-WEI
,
LIN, HSIENUNG
,
LIN
,
CHUN
-
JUNG
Year of Publication
01.09.2023
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CONTROL CIRCUIT DEVICE
by
SU, ZHE-WEI
,
LIN, HSIENUNG
,
LIN
,
CHUN
-
JUNG
Year of Publication
01.03.2023
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TWI791200B
by
LIN
,
CHUN JUNG
,
GU, RUEI TING
Year of Publication
01.02.2023
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TWI849718B
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
,
YU, HONGI
Year of Publication
21.07.2024
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Dental clamping apparatus
by
LIN
,
CHUN
-
JUNG
Year of Publication
21.08.2017
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System in package characterized in that the system in package can achieve the effects of greatly thinning the thickness of the package and lowering the whole cost by not having the printed circuit board in the package structure
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
Year of Publication
16.09.2022
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Thin type system-in-package having no printed circuit board in the package structure, and multiple dies are on a top surface of a copper support
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
Year of Publication
16.09.2022
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Chip package with metal shielding layer and manufacturing method thereof wherein the metal shielding layer covers the surface of the chip to prevent electromagnetic or optical interference thereby enhancing the structural strength of the chip package
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
,
YU, HONGI
Year of Publication
16.05.2024
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Chip packaging structure with electromagnetic interference shielding layer and manufacturing method thereof wherein a specialized EMI shielding layer is designed to enhance a product reliability and competitiveness by isolating and insulating electrical connections
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
,
YU, HONGI
Year of Publication
01.05.2024
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TWI839749B
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
,
YU, HONGI
Year of Publication
21.04.2024
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