Terabus: Terabit/Second-Class Card-Level Optical Interconnect Technologies
Schares, L., Kash, J.A., Doany, F.E., Schow, C.L., Schuster, C., Kuchta, D.M., Pepeljugoski, P.K., Trewhella, J.M., Baks, C.W., John, R.A., Shan, L., Kwark, Y.H., Budd, R.A., Chiniwalla, P., Libsch, F.R., Rosner, J., Tsang, C.K., Patel, C.S., Schaub, J.D., Dangel, R., Horst, F., Offrein, B.J., Kucharski, D., Guckenberger, D., Hegde, S., Nyikal, H., Chao-Kun Lin, Tandon, A., Trott, G.R., Nystrom, M., Bour, D.P., Tan, M.R.T., Dolfi, D.W.
Published in IEEE journal of selected topics in quantum electronics (01.09.2006)
Published in IEEE journal of selected topics in quantum electronics (01.09.2006)
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Journal Article
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology
Knickerbocker, J.U., Patel, C.S., Andry, P.S., Tsang, C.K., Paivikki Buchwalter, L., Sprogis, E., Hua Gan, Horton, R.R., Polastre, R., Wright, S.L., Schuster, C., Baks, C., Doany, F., Rosner, J., Cordes, S.
Published in Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005 (2005)
Published in Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005 (2005)
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Conference Proceeding