Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys
Henderson, Donald W., Gosselin, Timothy, Sarkhel, Amit, Kang, Sung K., Choi, Won-Kyoung, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.11.2002)
Published in Journal of materials research (01.11.2002)
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Journal Article
Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
Kang, Sung K., Shih, Da-Yuan, Leonard, Donovan, Henderson, Donald W., Gosselin, Timothy, Cho, Sung-il, Yu, Jin, Choi, Won K.
Published in JOM (1989) (01.06.2004)
Published in JOM (1989) (01.06.2004)
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Improving Copper Electrodeposition in the Microelectronics Industry
Yihua Liu, Liang Yin, Bliznakov, S., Kondos, P., Borgesen, P., Henderson, D.W., Parks, C., Ju Wang, Cotts, E.J., Dimitrov, N.
Published in IEEE transactions on components and packaging technologies (01.03.2010)
Published in IEEE transactions on components and packaging technologies (01.03.2010)
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Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates
KORHONEN, Tia-Marje K, TURPEINEN, Pekka, LEHMAN, Lawrence P, BOWMAN, Brian, THIEL, George H, PARKES, Raymond C, KORHONEN, Matt A, HENDERSON, Donald W, PUTTLITZ, Karl J
Published in Journal of electronic materials (01.12.2004)
Published in Journal of electronic materials (01.12.2004)
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Interfacial reaction studies on lead (Pb)-free solder alloys
Kang, S.K., Shih, D.Y., Fogel, K., Lauro, P., Myung-Jin Yim, Advocate, G.G., Griffin, M., Goldsmith, C., Henderson, D.W., Gosselin, T.A., King, D.E., Konrad, J.J., Sarkhel, A., Puttlitz, K.J.
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)
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Journal Article
The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue
Henderson, Donald W., Woods, James J., Gosselin, Timothy A., Bartelo, Jay, King, David E., Korhonen, T.M., Korhonen, M.A., Lehman, L.P., Cotts, E.J., Kang, Sung K., Lauro, Paul, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.06.2004)
Published in Journal of materials research (01.06.2004)
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Journal Article
Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
Kang, Sung K., Shih, Da-Yuan, Donald, NY, Henderson, W., Gosselin, Timothy, Sarkhel, Amit, Charles Goldsmith, NY, Puttlitz, Karl J., Choi, Won Kyoung
Published in JOM (1989) (01.06.2003)
Published in JOM (1989) (01.06.2003)
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Journal Article
Controlling Ag^sub 3^Sn Plate Formation in Near-Ternary-Eutectic Sn-Ag-Cu Solder by Minor Zn Alloying
Kang, Sung K, Da-Yuan, Shih, Donovan, Leonard, Henderson, Donald W
Published in JOM (1989) (01.06.2004)
Get full text
Published in JOM (1989) (01.06.2004)
Journal Article
Controlling Agsub 3Sn Plate Formation in Near-Ternary-Eutectic Sn-Ag-Cu Solder by Minor Zn Alloying
Kang, Sung K, Shih, Da-Yuan, Leonard, Donovan, Henderson, Donald W
Published in JOM (1989) (01.06.2004)
Get full text
Published in JOM (1989) (01.06.2004)
Journal Article
Ag^sub 3^Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
Kang, Sung K, Choi, Won Kyoung, Da-Yuan, Shih, Henderson, Donald W
Published in JOM (1989) (01.06.2003)
Get full text
Published in JOM (1989) (01.06.2003)
Journal Article
Ag 3 Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys
Henderson, Donald W., Gosselin, Timothy, Sarkhel, Amit, Kang, Sung K., Choi, Won-Kyoung, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.11.2002)
Published in Journal of materials research (01.11.2002)
Get full text
Journal Article
The role of Swan-Ganz catheterization in severe pregnancy-induced hypertension
Henderson, D W, Vilos, G A, Milne, K J, Nichol, P M
Published in American journal of obstetrics and gynecology (01.03.1984)
Published in American journal of obstetrics and gynecology (01.03.1984)
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