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WIRE-BOND DAMPER FOR SHOCK ABSORPTION
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WIRE-BOND DAMPER FOR SHOCK ABSORPTION
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Year of Publication 31.05.2022
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Design and implementation of a CMOS-MEMS microphone without the back-plate
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Published in 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) (01.06.2017)
Published in 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) (01.06.2017)
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Conference Proceeding
Wire-bond damper for shock absorption
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Year of Publication 21.05.2024
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WIRE-BOND DAMPER FOR SHOCK ABSORPTION
Mao, Wei-Jhih, Chang, Kuei-Sung, Hsieh, Tsung-Lin, Cheng, Chun-Wen, Tsai, Shang-Ying
Year of Publication 30.11.2023
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Year of Publication 30.11.2023
Patent