Reinforcement Learning-based Auto-router considering Signal Integrity
Kim, Minsu, Park, Hyunwook, Kim, Seongguk, Son, Keeyoung, Kim, Subin, Son, Kyunjune, Choi, Seonguk, Park, Gapyeol, Kim, Joungho
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
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Conference Proceeding
A Parallel-in-Time Circuit Simulator for Power Delivery Networks with Nonlinear Load Models
Cheng, Chung-Kuan, Ho, Chia-Tung, Jia, Chao, Wang, Xinyuan, Zen, Zhiyu, Zha, Xin
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
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Conference Proceeding
Measurement Uncertainty Propagation in the Validation of High-Speed Interconnects
Geyik, Cemil S., Hill, Michael J., Zhang, Zhichao, Aygun, Kemal, Aberle, James T.
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
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Conference Proceeding
ANN Performance for the Prediction of High-Speed Digital Interconnects over Multiple PCBs
Scharff, Katharina, Schierholz, Christian Morten, Yang, Cheng, Schuster, Christian
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
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Conference Proceeding
RX Equalization for a High-Speed Channel based on Bayesian Active Learning using Dropout
Yang, Xianbo, Tang, Junyan, Torun, Hakki M., Becker, Wiren D., Hejase, Jose A., Swaminathan, Madhavan
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
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Conference Proceeding
PCIe Gen-5 Design Challenges of High-Speed Servers
Vasa, Mallikarjun, Liao, Chun-Lin, Kumar, Sanjay, Chen, Ching-Huei, Mutnury, Bhyrav
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
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Conference Proceeding
Augmented PEEC for direct time-domain thermal and power estimation of Integrated Voltage Regulator architectures arising in Heterogeneous Integration
Avula, Venkatesh, Smet, Vanessa, Joshi, Yogendra, Swaminathan, Madhavan
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
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Conference Proceeding
Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards
Sepaintner, Felix, Scharl, Andreas, Jakob, Johannes, Keck, Florian, Kunze, Kevin, Rohrl, Franz Xaver, Bogner, Werner, Zorn, Stefan
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
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Conference Proceeding
On Dissipativity Conditions for Linearized Models of Locally Active Circuit Blocks
Bradde, T., Grivet-Talocia, S., Calafiore, G. C., Proskurnikov, A. V., Mahmood, Z., Daniel, L.
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
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Conference Proceeding
Estimating Per-Unit-Length Resistance Parameter in Emerging Copper-Graphene Hybrid Interconnects via Prior Knowledge based Accelerated Neural Networks
Kumar, Rahul, Likith Narayan, S. S., Kumar, Somesh, Roy, Sourajeet, Kaushik, Brajesh K., Achar, Ramachandra, Sharma, Rohit
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
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Conference Proceeding