Search Results - "SHEN, CHIH-TA" :: K.UTB vyhledávací portál

GIGA GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE

by YU CHEN HUA, HOU SHANG YUN, SHIH YING CHING, LU SZU WEI, SHEN CHIH TA, WU CHI HSI, HUANG PING KANG, CHIU SAO LING, WEI WEN HSIN, HU HSIEN PIN, CHIOU WEN CHIH
Year of Publication 01.12.2021

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CHIP PACKAGE AND METHODS FOR FORMING THE SAME

by Ting, Kuo-Chiang, Hou, Shang-Yun, Huang, Kuan-Yu, Hsu, Chia-Hao, Huang, Sung-Hui, Hsu, Hsien-Pin, Shen, Chih-Ta
Year of Publication 21.03.2024

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GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE

by Huang, Ping-Kang, Hou, Shang-Yun, Chiu, Sao-Ling, Yu, Chen-Hua, Lu, Szu-Wei, Wei, Wen-Hsin, Chiou, Wen-Chih, Wu, Chi-Hsi, Shen, Chih-Ta, Hu, Hsien-Pin, Shih, Ying-Ching
Year of Publication 04.07.2024

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Giga interposer integration through Chip-On-Wafer-On-Substrate

by Huang, Ping-Kang, Hou, Shang-Yun, Chiu, Sao-Ling, Yu, Chen-Hua, Lu, Szu-Wei, Wei, Wen-Hsin, Chiou, Wen-Chih, Wu, Chi-Hsi, Shen, Chih-Ta, Hu, Hsien-Pin, Shih, Ying-Ching
Year of Publication 23.04.2024

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Giga interposer integration through chip-on-wafer-on-substrate

by Huang, Ping-Kang, Hou, Shang-Yun, Chiu, Sao-Ling, Yu, Chen-Hua, Lu, Szu-Wei, Wei, Wen-Hsin, Chiou, Wen-Chih, Wu, Chi-Hsi, Shen, Chih-Ta, Hu, Hsien-Pin, Shih, Ying-Ching
Year of Publication 15.08.2023

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GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE

by Huang, Ping-Kang, Hou, Shang-Yun, Chiu, Sao-Ling, Yu, Chen-Hua, Lu, Szu-Wei, Wei, Wen-Hsin, Chiou, Wen-Chih, Wu, Chi-Hsi, Shen, Chih-Ta, Hu, Hsien-Pin, Shih, Ying-Ching
Year of Publication 10.11.2022

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Giga Interposer Integration through Chip-On-Wafer-On-Substrate

by Huang, Ping-Kang, Hou, Shang-Yun, Chiu, Sao-Ling, Yu, Chen-Hua, Lu, Szu-Wei, Wei, Wen-Hsin, Chiou, Wen-Chih, Wu, Chi-Hsi, Shen, Chih-Ta, Hu, Hsien-Pin, Shih, Ying-Ching
Year of Publication 25.11.2021

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Bonded assembly and methods for forming the same

by HOU, SHANG-YUN, SHEN, CHIH-TA, HSU, CHIA-HAO, HU, HSIEN-PIN, HUANG, SUNG-HUI, HUANG, KUAN-YU, TING, KUOIANG
Year of Publication 01.04.2024

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GIGA-INTERPOSER-INTEGRATION DURCH CHIP-ON-WAFER-ON-SUBSTRAT UND VERFAHREN ZUR BILDUNG VON CHIP-ON-WAFER-ON-SUBSTRATE-PAKETEN

by Huang, Ping-Kang, Hou, Shang-Yun, Chiu, Sao-Ling, Yu, Chen-Hua, Lu, Szu-Wei, Wei, Wen-Hsin, Chiou, Wen-Chih, Wu, Chi-Hsi, Shen, Chih-Ta, Hu, Hsien-Pin, Shih, Ying-Ching
Year of Publication 14.07.2022

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Semiconductor structure and mthhod of forming the same

by HUANG, PING-KANG, HOU, SHANG-YUN, WU, CHI-HSI, SHEN, CHIH-TA, LU, SZU-WEI, CHIU, SAO-LING, HU, HSIEN-PIN, WEI, WEN-HSIN, CHIOU, WENIH, SHIH, YINGING, YU, CHEN-HUA
Year of Publication 11.07.2022

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Semiconductor structure and method of forming the same

by HUANG, PING-KANG, HOU, SHANG-YUN, WU, CHI-HSI, SHEN, CHIH-TA, LU, SZU-WEI, CHIU, SAO-LING, HU, HSIEN-PIN, WEI, WEN-HSIN, CHIOU, WENIH, SHIH, YINGING, YU, CHEN-HUA
Year of Publication 01.12.2021

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GIGA-INTERPOSER-INTEGRATION DURCH CHIP-ON-WAFER-ON-SUBSTRAT

by Huang, Ping-Kang, Hou, Shang-Yun, Chiu, Sao-Ling, Yu, Chen-Hua, Lu, Szu-Wei, Wei, Wen-Hsin, Chiou, Wen-Chih, Wu, Chi-Hsi, Shen, Chih-Ta, Hu, Hsien-Pin, Shih, Ying-Ching
Year of Publication 25.11.2021

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