Surface treatment method of solder ball for electronic packaging
ZHANG WENQIAN, LIANG CUNLONG, LEI YONGPING, ZHANG BINGBING, WANG TONGJU, QIN ZHENZHONG
Year of Publication 30.07.2024
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Year of Publication 30.07.2024
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Flux paste for BGA (ball grid array) packaging and preparation method of flux paste
ZHANG WENQIAN, LIANG CUNLONG, LEI YONGPING, CHEN XICHENG, WANG TONGJU, QIN ZHENZHONG
Year of Publication 11.06.2024
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Year of Publication 11.06.2024
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