Search Results - "Goodlin, Brian E." :: K.UTB vyhledávací portál

IC having trench-based metal-insulator-metal capacitor

by Kinder, Erich Wesley, Mahalingam, Pushpa, Goodlin, Brian E, Aghoram, Umamaheswari, Srinivasan, Bhaskar, Eissa, Mona M
Year of Publication 28.03.2023

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IC HAVING TRENCH-BASED METAL-INSULATOR-METAL CAPACITOR

by KINDER, Erich Wesley, AGHORAM, Umamaheswari, EISSA, Mona M, MAHALINGAM, Pushpa, SRINIVASAN, Bhaskar, GOODLIN, Brian E
Year of Publication 16.11.2022

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Electronic devices with bond pads formed on a molybdenum layer

by Goodlin, Brian E, Jackson, Ricky Alan, Yen, Ting-Ta
Year of Publication 17.11.2020

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IC HAVING TRENCH-BASED METAL-INSULATOR-METAL CAPACITOR

by KINDER, Erich Wesley, AGHORAM, Umamaheswari, EISSA, Mona M, MAHALINGAM, Pushpa, SRINIVASAN, Bhaskar, GOODLIN, Brian E
Year of Publication 20.07.2022

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Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

by Yoshino, Makoto, Goodlin, Brian E, Kuroda, Ayumu, Wachtler, Kurt Peter, Yano, Genki, Jacobsen, Stuart, Kirmse, Karen, Cook, Benjamin
Year of Publication 15.11.2022

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IC HAVING TRENCH-BASED METAL-INSULATOR-METAL CAPACITOR

by Kinder, Erich Wesley, Mahalingam, Pushpa, Goodlin, Brian E, Aghoram, Umamaheswari, Srinivasan, Bhaskar, Eissa, Mona M
Year of Publication 21.10.2021

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IC having trench-based metal-insulator-metal capacitor

by Kinder, Erich Wesley, Mahalingam, Pushpa, Goodlin, Brian E, Aghoram, Umamaheswari, Srinivasan, Bhaskar, Eissa, Mona M
Year of Publication 27.07.2021

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Method for producing specific termination angle in titanium tungsten layer

by GOODLIN BRIAN E, DELLAS NICHOLAS S, BLASIAK MACIEJ, JIANG NENG
Year of Publication 19.03.2024

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IC HAVING TRENCH-BASED METAL-INSULATOR-METAL CAPACITOR

by KINDER, Erich Wesley, AGHORAM, Umamaheswari, EISSA, Mona M, MAHALINGAM, Pushpa, SRINIVASAN, Bhaskar, GOODLIN, Brian E
Year of Publication 18.03.2021

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IC HAVING TRENCH-BASED METAL-INSULATOR-METAL CAPACITOR

by Kinder, Erich Wesley, Mahalingam, Pushpa, Goodlin, Brian E, Aghoram, Umamaheswari, Srinivasan, Bhaskar, Eissa, Mona M
Year of Publication 11.03.2021

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Devices with specific termination angles in titanium tungsten layers and methods for fabricating the same

by Dellas, Nicholas S, Goodlin, Brian E, Jiang, Neng, Blasiak, Maciej
Year of Publication 26.06.2018

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Infrared sensor design using an epoxy film as an infrared absorption layer

by Meinel, Walter Baker, Goodlin, Brian E, Jackson, Ricky Alan, Lazarov, Kalin Valeriev
Year of Publication 25.02.2020

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Infrared sensor design using an epoxy film as an infrared absorption layer

by Meinel, Walter Baker, Goodlin, Brian E, Jackson, Ricky Alan, Lazarov, Kalin Valeriev
Year of Publication 07.01.2020

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STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL SYSTEM STACKED ONTO ELECTRONIC CIRCUIT CHIP

by Yoshino, Makoto, Goodlin, Brian E, Kuroda, Ayumu, Wachtler, Kurt Peter, Yano, Genki, Jacobsen, Stuart, Kirmse, Karen, Cook, Benjamin
Year of Publication 12.11.2020

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Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

by Yoshino, Makoto, Goodlin, Brian E, Kuroda, Ayumu, Wachtler, Kurt Peter, Yano, Genki, Jacobsen, Stuart, Kirmse, Karen, Cook, Benjamin
Year of Publication 28.07.2020

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