SELF-FORMING BARRIER LAYER IN COPPER METALLIZATION AND INTEGRATION OF RUTHENIUM METAL LINER
MAEKAWA KAORU, KIKUCHI YUKI, CORY WAJDA, KAWASAKI HIROAKI, NAGAI HIROYUKI, OYA MANABU, GERRIT J LEUSINK, YU KAI-HUNG
Year of Publication 17.08.2017
Get full text
Year of Publication 17.08.2017
Patent
THERMAL ETCHING OF RUTHENIUM
Leusink, Gerrit, Clark, Robert, Wajda, Cory, Higuchi, Hisashi, Tapily, Kandabara, Yu, Kai-Hung, Pattanaik, Gyanaranjan
Year of Publication 09.05.2024
Get full text
Year of Publication 09.05.2024
Patent
THERMAL ETCHING OF RUTHENIUM
YU, Kai-Hung, WAJDA, Cory, PATTANAIK, Gyanaranjan, LEUSINK, Gerrit, CLARK, Robert, TAPILY, Kandabara, HIGUCHI, Hisashi
Year of Publication 16.05.2024
Get full text
Year of Publication 16.05.2024
Patent
SELECTIVE INHIBITION FOR SELECTIVE METAL DEPOSITION
Suzuki, Hidenao, Niimi, Hiroaki, Wajda, Cory, Clark, Robert D, Tapily, Kandabara, Yu, Kai-Hung, Yonezawa, Ryota, Miyahara, Takahiro
Year of Publication 31.08.2023
Get full text
Year of Publication 31.08.2023
Patent
SELECTIVE INHIBITION FOR SELECTIVE METAL DEPOSITION
YU, Kai-Hung, WAJDA, Cory, SUZUKI, Hidenao, CLARK, Robert, YONEZAWA, Ryota, NIIMI, Hiroaki, TAPILY, Kandabara, MIYAHARA, Takahiro
Year of Publication 31.08.2023
Get full text
Year of Publication 31.08.2023
Patent
Method for controlling the forming voltage in resistive random access memory devices
Consiglio, Steven, Narayanan, Vijay, Tsunomura, Takaaki, Wajda, Cory, Jamison, Paul C, Hopstaken, Marinus J. P, Tapily, Kandabara, Cartier, Eduard A, Ando, Takashi
Year of Publication 11.07.2023
Get full text
Year of Publication 11.07.2023
Patent
METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH A LOW-RESISTIVITY METAL
YU, Kai-Hung, WAJDA, Cory, LEUSINK, Gerrit J, O'MEARA, David L, AIZAWA, Hirokazu, ZANDI, Omid, HIGUCHI, Hisashi
Year of Publication 12.05.2022
Get full text
Year of Publication 12.05.2022
Patent
METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH A LOW-RESISTIVITY METAL
Wajda, Cory, Leusink, Gerrit J, Zandi, Omid, Higuchi, Hisashi, Yu, Kai-Hung, O'Meara, David L, Aizawa, Hirokazu
Year of Publication 05.05.2022
Get full text
Year of Publication 05.05.2022
Patent
METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH A LOW-RESISTIVITY METAL
Trickett, Ying, Han, Yun, Liu, Eric Chih-Fang, Wajda, Cory, Leusink, Gerrit J, Niimi, Hiroaki, Clark, Robert D, Chang, Shihsheng, Yu, Kai-Hung, Pattanaik, Gyanaranjan, Zhang, Henan
Year of Publication 22.09.2022
Get full text
Year of Publication 22.09.2022
Patent