TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface
Shang, P. J., Liu, Z. Q., Li, D. X., Shang, J. K.
Published in Journal of electronic materials (01.12.2009)
Published in Journal of electronic materials (01.12.2009)
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Journal Article
Conference Proceeding
Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process
Shang, P.J., Zhang, L., Liu, Z.Q., Tan, J., Shang, J.K.
Published in Microelectronics and reliability (01.06.2013)
Published in Microelectronics and reliability (01.06.2013)
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Journal Article
Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings
Daghfal, John P., Shang, P. J., Liu, Z. Q., Shang, J. K.
Published in Journal of electronic materials (01.12.2009)
Published in Journal of electronic materials (01.12.2009)
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Journal Article
Conference Proceeding
Precipitates and precipitation behavior in Al–Zr–Yb–Cr alloys
Fang, H.C., Shang, P.J., Huang, L.P., Chen, K.H., Liu, G., Xiong, X.
Published in Materials letters (15.05.2012)
Published in Materials letters (15.05.2012)
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Journal Article
Weakening of the Cu/Cu3Sn(100) Interface by Bi Impurities
Pang, X. Y., Shang, P. J., Wang, S. Q., Liu, Z. Q., Shang, J. K.
Published in Journal of electronic materials (01.08.2010)
Published in Journal of electronic materials (01.08.2010)
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Journal Article
Power series and the open set condition of Hutchinson
Shang, Pengjian, Widder, Karl
Published in Journal of physics. A, Mathematical and general (30.01.2004)
Published in Journal of physics. A, Mathematical and general (30.01.2004)
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Journal Article