A Micromechanical Analysis to the Viscoplastic Behavior of Sintered Silver Joints under Shear Loading
Ma, Kun, Liu, Xun, Sun, Yameng, Song, Yifan, Feng, Zheng, Zhou, Yang, Liu, Sheng
Published in Materials (19.06.2023)
Published in Materials (19.06.2023)
Get full text
Journal Article
Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods
Sun, Yameng, Ma, Kun, Song, Yifan, Zi, Tongtong, Liu, Xun, Feng, Zheng, Zhou, Yang, Liu, Sheng
Published in Micromachines (Basel) (30.08.2023)
Published in Micromachines (Basel) (30.08.2023)
Get full text
Journal Article
Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible Devices
Zhang, Yuexin, Wang, Shizhao, Dong, Fang, Sun, Yameng, Sheng, Can, Ma, Kun, Tian, Zhiqiang, Qian, Zhengfang, Wong, Chingping, Liu, Sheng
Published in Micromachines (Basel) (15.02.2022)
Published in Micromachines (Basel) (15.02.2022)
Get full text
Journal Article
Study of the deposition of nanopillar-patterned 4H-SiC by molecular dynamics simulation
Xue, Lianghao, Feng, Gan, Wu, Gai, Wang, Shizhao, Li, Rui, Han, Xu, Sun, Yameng, Liu, Sheng
Published in Applied surface science (30.03.2022)
Published in Applied surface science (30.03.2022)
Get full text
Journal Article
Physics-Based Model for Understanding Electromigration-Induced Cavity Evolution in Advanced Narrow Line Copper Interconnects
Wang, Shizhao, Cheng, Chunmin, Liu, Tianjian, Zhang, Hehui, Xue, Lianghao, Sun, Yameng, Han, Xu, Liu, Sheng
Published in IEEE transactions on electron devices (01.09.2022)
Published in IEEE transactions on electron devices (01.09.2022)
Get full text
Journal Article
Optimization of Cu protrusion of wafer-to-wafer hybrid bonding for HBM packages application
Wang, Shizhao, Zhang, Hehui, Tian, Zhiqiang, Liu, Tianjian, Sun, Yameng, Zhang, Yuexin, Dong, Fang, Liu, Sheng
Published in Materials science in semiconductor processing (01.12.2022)
Published in Materials science in semiconductor processing (01.12.2022)
Get full text
Journal Article
Indenter radius effect on mechanical response of a-(11–20), c-(0001), and m-(-1100) plane GaN single crystals in nanoindentation: A molecular dynamics study
Li, Rui, Wu, Gai, Liang, Kang, Wang, Shizhao, Xue, Lianghao, Sun, Yameng, Dong, Fang, Li, Hui, Liu, Sheng
Published in Materials science in semiconductor processing (01.07.2022)
Published in Materials science in semiconductor processing (01.07.2022)
Get full text
Journal Article
Surface action mechanism and design considerations for the mechanical integrity of cu/low K BEOL interconnect during chemical mechanical polishing process
Wang, Shizhao, Liu, TianJian, Dong, Fang, Sun, Yameng, Xue, Lianghao, Li, Rui, Han, Xu, Tian, Zhiqiang, Liu, Sheng
Published in Microelectronics and reliability (01.07.2022)
Published in Microelectronics and reliability (01.07.2022)
Get full text
Journal Article
Display substrate and display device
YOU JIANHUI, ZHANG AO, TANG RAN, QI CHAO, YIN YAOJIN, YANG YINGFAN, LUO NING, ZHANG LE, SUN YAMENG, ZHANG LIN
Year of Publication 05.01.2024
Get full text
Year of Publication 05.01.2024
Patent