Search Results - "REED, Jason D" :: K.UTB vyhledávací portál

High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn-Cu Bonding for Three-Dimensional Integrated Circuits

by Lueck, M. R., Reed, J. D., Gregory, C. W., Huffman, A., Lannon, J. M., Temple, D. S.
Published in IEEE transactions on electron devices (01.07.2012)

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Sample preparation technique for cross-sectional transmission electron microscopy of quantum wire structures

by Chen, Y P, Reed, J D, O'Keefe, S S, Schaff, W J, Eastman, L F
Published in Microscopy research and technique (01.10.1993)

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Integrated optical micro-electromechanical systems and methods of fabricating and operating the same

by MIRACKY ROBERT F, REED JASON D, HU KAI, HILBERT CLAUDE
Year of Publication 21.10.2003

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Patent

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Apparatus and method for micro-electromechanical systems two-dimensional large movement electrostatic comb drive

by MIRACKY ROBERT F, REED JASON D, HU KAI, HILBERT CLAUDE
Year of Publication 26.09.2002

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Patent

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Integrated optical micro-electromechanical systems and methods of fabricating and operating the same

by MIRACKY ROBERT F, REED JASON D, HU KAI, HILBERT CLAUDE
Year of Publication 08.08.2002

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Patent

High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn-Cu Bonding for Three-Dimensional Integrated Circuits

Sample preparation technique for cross-sectional transmission electron microscopy of quantum wire structures

Integrated optical micro-electromechanical systems and methods of fabricating and operating the same

Apparatus and method for micro-electromechanical systems two-dimensional large movement electrostatic comb drive

Integrated optical micro-electromechanical systems and methods of fabricating and operating the same

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