Modelling of keyhole dynamics and porosity formation considering the adaptive keyhole shape and three-phase coupling during deep-penetration laser welding
Zhao, Haiyan, Niu, Wenchong, Zhang, Bin, Lei, Yongping, Kodama, Masaru, Ishide, Takashi
Published in Journal of physics. D, Applied physics (07.12.2011)
Published in Journal of physics. D, Applied physics (07.12.2011)
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Journal Article
A new method for producing uniform droplets by continuous-ink-jet technology
Wang, Tongju, Lin, Jian, Guo, Xingye, Lei, Yongping, Fu, Hanguang
Published in Review of scientific instruments (01.08.2018)
Published in Review of scientific instruments (01.08.2018)
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Journal Article
Effect of Molybdenum on the Microstructures and Properties of Stainless Steel Coatings by Laser Cladding
Wang, Kaiming, Chang, Baohua, Chen, Jiongshen, Fu, Hanguang, Lin, Yinghua, Lei, Yongping
Published in Applied sciences (15.10.2017)
Published in Applied sciences (15.10.2017)
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Journal Article
Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder
Shi, Yaowu, Tian, Jun, Hao, Hu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Published in Journal of alloys and compounds (03.04.2008)
Published in Journal of alloys and compounds (03.04.2008)
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Journal Article
Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy
Dong, Wenxing, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Published in Journal of electronic materials (01.07.2008)
Published in Journal of electronic materials (01.07.2008)
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Journal Article
Investigation of rare earth-doped BiAg high-temperature solders
Shi, Yaowu, Fang, Weiping, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of materials science. Materials in electronics (01.09.2010)
Published in Journal of materials science. Materials in electronics (01.09.2010)
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Journal Article
Effect of phosphorus element on the comprehensive properties of Sn–Cu lead-free solder
Li, Guangdong, Shi, Yaowu, Hao, Hu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Published in Journal of alloys and compounds (18.02.2010)
Published in Journal of alloys and compounds (18.02.2010)
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Journal Article
Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach
Xu, Guangchen, Guo, Fu, Wang, Xitao, Xia, Zhidong, Lei, Yongping, Shi, Yaowu, Li, Xiaoyan
Published in Journal of alloys and compounds (21.01.2011)
Published in Journal of alloys and compounds (21.01.2011)
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Journal Article
Effect of rare earth on mechanical creep–fatigue property of SnAgCu solder joint
Xiao, WeiMin, Shi, YaoWu, Xu, GuangChen, Ren, Ren, Guo, Fu, Xia, ZhiDong, Lei, YongPing
Published in Journal of alloys and compounds (20.03.2009)
Published in Journal of alloys and compounds (20.03.2009)
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Journal Article
Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging
Hao, Hu, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Published in Journal of electronic materials (2008)
Published in Journal of electronic materials (2008)
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Journal Article
Conference Proceeding
Creep property of composite solders reinforced by nano-sized particles
Shi, Yaowu, Liu, Jianping, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of materials science. Materials in electronics (01.04.2008)
Published in Journal of materials science. Materials in electronics (01.04.2008)
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Journal Article
Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles
Shi, Yaowu, Liu, Jianping, Yan, Yanfu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of electronic materials (01.04.2008)
Published in Journal of electronic materials (01.04.2008)
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Journal Article
Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint
Li, Bo, Shi, Yaowu, Lei, Yongping, Guo, Fu, Xia, Zhidong, Zong, Bin
Published in Journal of electronic materials (01.03.2005)
Published in Journal of electronic materials (01.03.2005)
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Journal Article
Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints
Li, Guangdong, Shi, Yaowu, Hao, Hu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of materials science. Materials in electronics (01.02.2009)
Published in Journal of materials science. Materials in electronics (01.02.2009)
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Journal Article
Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration
Guo, Fu, Xu, Guangchen, Sun, Jia, Xia, Zhidong, Lei, Yongping, Shi, Yaowu, Li, Xiaoyan
Published in Journal of electronic materials (01.12.2009)
Published in Journal of electronic materials (01.12.2009)
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Journal Article
Conference Proceeding
Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test
Zhang, Ning, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of electronic materials (01.10.2008)
Published in Journal of electronic materials (01.10.2008)
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Journal Article