Effects of Sn grain structure on the electromigration of Sn–Ag solder joints
Wang, Yiwei, Lu, Kuan H., Gupta, Vikas, Stiborek, Leon, Shirley, Dwayne, Chae, Seung-Hyun, Im, Jay, Ho, Paul S.
Published in Journal of materials research (28.04.2012)
Published in Journal of materials research (28.04.2012)
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Journal Article
Characterization of the Viscoelasticity of Molding Compounds in the Time Domain
Chae, Seung-Hyun, Zhao, Jie-Hua, Edwards, Darvin R., Ho, Paul S.
Published in Journal of electronic materials (01.04.2010)
Published in Journal of electronic materials (01.04.2010)
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Journal Article
Kinetic Analysis of Current Enhanced Intermetallic Growth and Its Effect on Electromigration Reliability of Solder Joints
Huang-Lin Chao, Seung-Hyun Chae, Xuefeng Zhang, Kuan-Hsun Lu, Im, J., Ho, P.S.
Published in 2006 IEEE International Reliability Physics Symposium Proceedings (01.03.2006)
Published in 2006 IEEE International Reliability Physics Symposium Proceedings (01.03.2006)
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Conference Proceeding
Semiconducting π-extended porphyrin dimer and its characteristics in OFET and OPVC
Park, Woo Jea, Chae, Seung Hyun, Shin, Jicheol, Choi, Dong Hoon, Lee, Suk Joong
Published in Synthetic metals (01.07.2015)
Published in Synthetic metals (01.07.2015)
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Journal Article
Effective thermally activated delayed fluorescence emitter and its performance in OLED device
Park, Woo Jae, Lee, Yosup, Kim, Jun Yun, Yoon, Dae Wi, Kim, Jinook, Chae, Seung Hyun, Kim, Hyojeong, Lee, Gahyeon, Shim, Sangdeok, Yang, Joong Hwan, Lee, Suk Joong
Published in Synthetic metals (01.11.2015)
Published in Synthetic metals (01.11.2015)
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Journal Article