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Year of Publication 15.07.1999
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Year of Publication 13.06.2006
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Year of Publication 13.06.2006
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Year of Publication 17.02.2005
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Barrier layers for electroplated SnPb eutectic solder joints
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Year of Publication 10.08.1999
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Year of Publication 10.08.1999
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Flip-Chip interconnections using lead-free solders
HORKANS WILMA JEAN, ANDRICACOS PANAYOTIS CONSTANTINOU, DELIGIANNI HARIKLIA, KWIETNIAK KEITH THOMAS, DATTA MADHAV, SHI LEATHEN, MATHAD GANGADHARA SWAMI, TONG HO-MING, KANG SUNG KWON, PURUSHOTHAMAN SAMPATH
Year of Publication 01.05.2001
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Year of Publication 01.05.2001
Patent
Flip-chip interconnections using lead-free solders
HO-MING TONG, MADAV DATTA, SAMPATH PURUSHOTHAMAN, SUNG KWON KANG, LEATHEN SHI, KEITH THOMAS KWIETNIAK, HARIKLIA DELIGIANNI, PANAYOTIS CONSTANTINOU ANDRICACOS, WILMA JEAN HORKANS, GANGADHARA SWAMI MATHAD
Year of Publication 08.04.1998
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Year of Publication 08.04.1998
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Flip-chip interconnections using lead-free solders
HO-MING TONG, MADAV DATTA, SAMPATH PURUSHOTHAMAN, SUNG KWON KANG, LEATHEN SHI, KEITH THOMAS KWIETNIAK, HARIKLIA DELIGIANNI, PANAYOTIS CONSTANTINOU ANDRICACOS, WILMA JEAN HORKANS, GANGADHARA SWAMI MATHAD
Year of Publication 24.09.1997
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Year of Publication 24.09.1997
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