Search Results - "DAS RABINDRA N" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Spectrum of rheumatological disorders: an experience of 337 cases in a tertiary care hospital in Pokhara valley, Nepal

Spectrum of rheumatological disorders: an experience of 337 cases in a tertiary care hospital in Pokhara valley, Nepal

by DAS, Rabindra N., PAUDEL, Raju
Published in APLAR journal of rheumatology (01.09.2006)

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Journal Article

Multi-layer semiconductor structure and methods for fabricating multi-layer semiconductor structures

Multi-layer semiconductor structure and methods for fabricating multi-layer semiconductor structures

by Das, Rabindra N
Year of Publication 12.03.2019

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Patent

MULTI-LAYER SEMICONDUCTOR STRUCTURE AND METHODS FOR FABRICATING MULTI-LAYER SEMICONDUCTOR STRUCTURES

MULTI-LAYER SEMICONDUCTOR STRUCTURE AND METHODS FOR FABRICATING MULTI-LAYER SEMICONDUCTOR STRUCTURES

by DAS, Rabindra, N
Year of Publication 29.03.2018

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Patent

Multi-Layer Semiconductor Structure and Methods for Fabricating Multi-Layer Semiconductor Structures

Multi-Layer Semiconductor Structure and Methods for Fabricating Multi-Layer Semiconductor Structures

by Das Rabindra N
Year of Publication 06.07.2017

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Patent

Cryogenic electronic packages and assemblies

Cryogenic electronic packages and assemblies

by Das, Rabindra N, Dauler, Eric A
Year of Publication 10.03.2020

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Patent

Cryogenic electronic packages and methods for fabricating cryogenic electronic packages

Cryogenic electronic packages and methods for fabricating cryogenic electronic packages

by Das, Rabindra N, Dauler, Eric A
Year of Publication 13.08.2019

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Patent

Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages

Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages

by Das, Rabindra N, Dauler, Eric A
Year of Publication 26.03.2019

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Patent

CRYOGENIC ELECTRONIC PACKAGES AND ASSEMBLIES

CRYOGENIC ELECTRONIC PACKAGES AND ASSEMBLIES

by Das Rabindra N, Dauler Eric A
Year of Publication 12.04.2018

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Patent

CRYOGENIC ELECTRONIC PACKAGES AND METHODS FOR FABRICATING CRYOGENIC ELECTRONIC PACKAGES

CRYOGENIC ELECTRONIC PACKAGES AND METHODS FOR FABRICATING CRYOGENIC ELECTRONIC PACKAGES

by Das Rabindra N, Dauler Eric A
Year of Publication 12.04.2018

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Patent

INTERCONNECT STRUCTURES AND SEMICONDUCTOR STRUCTURES FOR ASSEMBLY OF CRYOGENIC ELECTRONIC PACKAGES

INTERCONNECT STRUCTURES AND SEMICONDUCTOR STRUCTURES FOR ASSEMBLY OF CRYOGENIC ELECTRONIC PACKAGES

by Das Rabindra N, Dauler Eric A
Year of Publication 28.12.2017

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Patent

Method of making a circuitized substrate

Method of making a circuitized substrate

by Das Rabindra N, Rowlands Michael J
Year of Publication 16.08.2016

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Patent

Method of making a circuitized substrate

Method of making a circuitized substrate

by Das Rabindra N, Papathomas Kostas I, Markovich Voya R
Year of Publication 05.09.2017

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Patent

Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structure

Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structure

by Das, Rabindra N, Yost, Donna-Ruth W, Warner, Keith, Vitale, Steven A, Chen, Chenson, Gouker, Mark A, Keast, Craig L
Year of Publication 17.09.2019

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Patent

Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits

Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits

by Das, Rabindra N, Yost, Donna-Ruth W, Oliver, William D, Gouker, Mark A, Rosenberg, Danna, Kerman, Andrew J
Year of Publication 27.08.2019

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Patent

Superconducting integrated circuit

Superconducting integrated circuit

by Das, Rabindra N, Bolkhovsky, Vladimir, Yoder, Jonilyn L, Hover, David J, Miloshi, Xhovalin, Stull, Corey W, Oliver, William D, Gouker, Mark A, Rosenberg, Danna
Year of Publication 19.05.2020

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Patent

Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates

Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates

by DAS RABINDRA N, ROWLANDS MICHAEL
Year of Publication 27.03.2012

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Patent

Shielded through via structures and methods for fabricating shielded through via structures

Shielded through via structures and methods for fabricating shielded through via structures

by Das, Rabindra N, Yost, Donna-Ruth W, Oliver, William D, Gouker, Mark A, Rosenberg, Danna, Kerman, Andrew J
Year of Publication 05.02.2019

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Patent

Multi-layer semiconductor devices fabricated using a combination of substrate and via structures and fabrication techniques

Multi-layer semiconductor devices fabricated using a combination of substrate and via structures and fabrication techniques

by Das Rabindra N, Gouker Pascale, Johnson Leonard M, Johnson Ryan C, Gouker Mark A
Year of Publication 30.01.2018

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Patent

Qubit and coupler circuit structures and coupling techniques

Qubit and coupler circuit structures and coupling techniques

by Das, Rabindra N, Yost, Donna-Ruth W, Oliver, William D, Gouker, Mark A, Rosenberg, Danna, Kerman, Andrew J
Year of Publication 20.11.2018

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Patent

Interconnect structures and methods for fabricating interconnect structures

Interconnect structures and methods for fabricating interconnect structures

by Das, Rabindra N, Yost, Donna-Ruth W, Oliver, William D, Gouker, Mark A, Rosenberg, Danna, Kerman, Andrew J
Year of Publication 06.11.2018

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Patent

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