A study on coining processes of solder bumps on organic substrates
Nah, Jae-Woong, Paik, Kyung Wook, Hwang, Tae-Kyung, Kim, Won-Hoe
Published in IEEE transactions on electronics packaging manufacturing (01.04.2003)
Published in IEEE transactions on electronics packaging manufacturing (01.04.2003)
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Journal Article
Novel approach for fast structured light framework using deep learning
Kim, Won-Hoe, Kim, Bongjoong, Chi, Hyung-Gun, Hyun, Jae-Sang
Published in Image and vision computing (01.10.2024)
Published in Image and vision computing (01.10.2024)
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Journal Article
Characterization of coined solder bumps on PCB pads
Jae-Woong Nah, Paik, K.W., Won-Hoe Kim, Ki-Rok Hur
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
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Conference Proceeding
Flip chip assembly on PCB substrates with coined solder bumps
Jae-Woong Nah, Paik, K.W., Soon-Jin Cho, Won-Hoe Kim
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
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Conference Proceeding
Study on coined solder bumps on micro-via PCBs
Jae-Woong Nah, Paik, K.W., Won-Hoe Kim, Ki-Rok Hur
Published in Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) (2001)
Published in Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) (2001)
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Conference Proceeding