An efficient lid design for cooling stacked flip-chip 3D packages
Sikka, K., Wakil, J., Toy, H., Hsichang Liu
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
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Conference Proceeding
A Practical Implementation of Silicon Microchannel Coolers for High Power Chips
Colgan, E.G., Furman, B., Gaynes, M., Graham, W.S., LaBianca, N.C., Magerlein, J.H., Polastre, R.J., Rothwell, M.B., Bezama, R.J., Choudhary, R., Marston, K.C., Toy, H., Wakil, J., Zitz, J.A., Schmidt, R.R.
Published in IEEE transactions on components and packaging technologies (01.06.2007)
Published in IEEE transactions on components and packaging technologies (01.06.2007)
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Journal Article
Silicon Microchannel Cooling for High Power Chips
Colgan, Evan G., Furman, Bruce, Gaynes, Mike, LaBianca, Nancy, Magerlein, John, Polastre, Robert, Bezama, R. J., Choudhary, Rehan, Marston, Ken, Toy, Hilton, Wakil, Jamil A., Schmidt, Roger
Published in HVAC&R research (01.10.2006)
Published in HVAC&R research (01.10.2006)
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Journal Article
Package cooling designs for a dual-chip electronic package with one high power chip
Arvelo, A., Toy, H., Sikka, K., Tai, A., Longworth, H., Wei Zou, Coffin, J.
Published in The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) (2004)
Published in The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) (2004)
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Conference Proceeding