3D heterogeneous integration for analog
Samoilov, Arkadii V., Tran, Khanh, Kerness, Nicole, Jones, Joy, McNally, Peter, Barnett, Stanley, Parent, Tyler, Ellul, Joseph, Srivastava, Anu, Ikeuchi, Kiyoko, Tie Wang, Tiao Zhou
Published in 2013 IEEE International Electron Devices Meeting (01.12.2013)
Published in 2013 IEEE International Electron Devices Meeting (01.12.2013)
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Conference Proceeding
Journal Article
Dedicated pre-clean reduces Epi's thermal budget
Samoilov, Arkadii V, Dale Du Bois, Comita, Paul B, Carlson, David
Published in Semiconductor International (01.11.2000)
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Published in Semiconductor International (01.11.2000)
Trade Publication Article