The Impact of Organic Additives on Copper Trench Microstructure
Marro, James B., Okoro, Chukwudi A., Obeng, Yaw S., Richardson, Kathleen C.
Published in Journal of the Electrochemical Society (01.01.2017)
Published in Journal of the Electrochemical Society (01.01.2017)
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Journal Article
Broadband Dielectric Spectroscopic Detection of Aliphatic Alcohol Vapors with Surface-Mounted HKUST-1 MOFs as Sensing Media
Amoah, Papa K, Hassan, Zeinab Mohammed, Franklin, Rhonda R, Baumgart, Helmut, Redel, Engelbert, Obeng, Yaw S
Published in Chemosensors (01.10.2022)
Published in Chemosensors (01.10.2022)
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Journal Article
Nanoporous Ultralow Dielectric Constant Organosilicates Templated by Triblock Copolymers
Yang, Shu, Mirau, Peter A, Pai, Chien-Shing, Nalamasu, Omkaram, Reichmanis, Elsa, Pai, Janice C, Obeng, Yaw S, Seputro, Joko, Lin, Eric K, Lee, Hae-Jeong, Sun, Jianing, Gidley, David W
Published in Chemistry of materials (01.01.2002)
Published in Chemistry of materials (01.01.2002)
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Journal Article
Generating Multiscale Gold Nanostructures on Glass without Sidewall Deposits Using Minimal Dry Etching Steps
Minnikanti, Saugandhika, Ahn, Jungjoon, Obeng, Yaw S, Reyes, Darwin R
Published in ACS nano (23.04.2019)
Published in ACS nano (23.04.2019)
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Journal Article
Influence of Metal–MoS2 Interface on MoS2 Transistor Performance: Comparison of Ag and Ti Contacts
Yuan, Hui, Cheng, Guangjun, You, Lin, Li, Haitao, Zhu, Hao, Li, Wei, Kopanski, Joseph J, Obeng, Yaw S, Hight Walker, Angela R, Gundlach, David J, Richter, Curt A, Ioannou, Dimitris E, Li, Qiliang
Published in ACS applied materials & interfaces (21.01.2015)
Published in ACS applied materials & interfaces (21.01.2015)
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Journal Article
Nondestructive Measurement of the Residual Stresses in Copper Through-Silicon Vias Using Synchrotron-Based Microbeam X-Ray Diffraction
Okoro, Chukwudi, Levine, Lyle E., Ruqing Xu, Hummler, Klaus, Obeng, Yaw S.
Published in IEEE transactions on electron devices (01.07.2014)
Published in IEEE transactions on electron devices (01.07.2014)
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Journal Article
Subsurface imaging of metal lines embedded in a dielectric with a scanning microwave microscope
You, Lin, Ahn, Jung-Joon, Obeng, Yaw S, Kopanski, Joseph J
Published in Journal of physics. D, Applied physics (03.02.2016)
Published in Journal of physics. D, Applied physics (03.02.2016)
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Journal Article
Microwave evaluation of electromigration susceptibility in advanced interconnects
Sunday, Christopher E, Veksler, Dmitry, Cheung, Kin C, Obeng, Yaw S
Published in Journal of applied physics (07.11.2017)
Published in Journal of applied physics (07.11.2017)
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Journal Article
Deterministic Tagging Technology for Device Authentication
Ahn, Jungjoon, Kim, Jihong, Kopanski, Joseph J., Obeng, Yaw S.
Published in 2021 International Conference on IC Design and Technology (ICICDT) (15.09.2021)
Published in 2021 International Conference on IC Design and Technology (ICICDT) (15.09.2021)
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Conference Proceeding
Application of Broadband RF Metrology to Integrated Circuit Interconnect Reliability Analyses: Monitoring Copper Interconnect Corrosion in 3D-ICs
Amoah, Papa K., Perez, Jesus, Obeng, Yaw S.
Published in 2020 IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS) (01.05.2020)
Published in 2020 IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS) (01.05.2020)
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Conference Proceeding
Accelerated Stress Test Assessment of Through-Silicon Via Using RF Signals
Okoro, C., Kabos, P., Obrzut, J., Hummler, K., Obeng, Y. S.
Published in IEEE transactions on electron devices (01.06.2013)
Published in IEEE transactions on electron devices (01.06.2013)
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Journal Article
Contactless Resonant Cavity Dielectric Spectroscopic Studies of Recycled Office Papers
Kombolias, Mary, Obrzut, Jan, Postek, Michael T., Poster, Dianne L., Obeng, Yaw S.
Published in Recycling (Basel) (01.12.2019)
Published in Recycling (Basel) (01.12.2019)
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Journal Article