Synthesis of high-quality monolayer tungsten disulfide with chlorophylls and its application for enhancing bone regeneration
Chen, Yi-Wen, Shie, Ming-You, Hsiao, Chien-Hsuan, Liang, Yu-Chun, Wang, Ben, Chen, I-Wen Peter
Published in NPJ 2D materials and applications (13.10.2020)
Published in NPJ 2D materials and applications (13.10.2020)
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Journal Article
Dual-Polarized Patch Array Antennas with Wide Beamwidth for Automotive Radar Applications
Hsu, Pei-Hsin, Liao, Chao-Hsiang, Sun, Jwo-Shiun, Li, Eric S., Chen, Yu-Liang Chun, Chin, Kuo-Sheng
Published in 2023 Asia-Pacific Microwave Conference (APMC) (05.12.2023)
Published in 2023 Asia-Pacific Microwave Conference (APMC) (05.12.2023)
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Conference Proceeding
Generic rules to achieve bump electromigration immortality for 3D IC integration
Hsiao-Yun Chen, Da-Yuan Shih, Cheng-Chang Wei, Chih-Hang Tung, Yi-Li Hsiao, Yu, Douglas Cheng-Hua, Yu-Chun Liang, Chih Chen
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Mechanical Effect Study of the Vehicle Braking on the Asphalt Pavement
Jin, Wei Dong, Zhang, Peng, Liang, Chun Yu, Gao, Xue Kai
Published in Applied Mechanics and Materials (23.03.2015)
Published in Applied Mechanics and Materials (23.03.2015)
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Journal Article
Application of Advanced Reliability Algorithms in Truss Structures
Hui-Jun, Li, Zeng-Li, Peng, Chun-Liang, Yu, Yue-Ming, Tu
Published in International journal of space structures (01.06.2014)
Published in International journal of space structures (01.06.2014)
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Journal Article
Readiness of SiC MOSFETs for Aerospace and Industrial Applications
Losee, Peter A., Lilienfeld, David, Arthur, Stephen, Bolotnikov, Alexander, Datta, Rajib, Smolenski, Joseph, Stevanovic, Ljubisa, Kennerly, Stacey, Harfman-Todorovic, Maja, Raju, Ravi, Yu, Liang Chun, Tao, Feng Feng, Dunne, Greg, Carastro, Fabio, Rowden, Brian, Esler, David, Schuetz, Tobias, Cioffi, Philip
Published in Materials Science Forum (24.05.2016)
Published in Materials Science Forum (24.05.2016)
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Journal Article
The temperature distribution and the thermal behavior in ultra fine pitch micro SnAg solder bump under current stressing
Hsin-Ying Peng, Chang, Y W, Yu-Chun Liang, Chih Chen, Chang, T C, Zhan, C J, Juang, J Y
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
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Conference Proceeding
Direct measurement of temperature distribution in flip-chip micro-bumps under current stressing by using infrared microscopy
Yu-Chun Liang, Chih Chen, Yao, D J, Chang, T C, Zhan, C J, Juang, J Y
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
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Conference Proceeding
Investigation on Temperature Field and Thermal Stress of Dish Solar Concentrator’s Focal Region
Shuai, Yong, Wang, Xing Zhi, Wang, Fu Qiang, Yu, Chun Liang
Published in Applied Mechanics and Materials (01.12.2011)
Published in Applied Mechanics and Materials (01.12.2011)
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Journal Article
Discrete element simulation of crushable rockfill materials
Lei Shao, Shi-chun Chi, Liang-jing Zhou, Yu-zan Wang
Published in Water Science and Engineering (01.04.2013)
Published in Water Science and Engineering (01.04.2013)
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Journal Article